ADN8830ACP-REEL Analog Devices Inc, ADN8830ACP-REEL Datasheet - Page 3

• Manufacturer Part Number: ADN8830ACP-REEL
• Description: IC THERMO COOLER CNTRLR 32-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADN8830ACP-REEL

• Rohs Status: RoHS non-compliant
• Applications: Thermoelectric Cooler
• Current - Supply: 8mA
• Voltage - Supply: 3.3 V ~ 5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LFCSP

ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . GND to V
Storage Temperature Range . . . . . . . . . . . . . –65 C to +150 C
Operating Temperature Range . . . . . . . . . . . . –40 C to +85 C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . 125 C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300 C
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
Model
ADN8830ACP
ADN8830ACP-REEL
ADN8830ACP-REEL7
ADN8830-EVAL
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN8830 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. C
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Temperature Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
THERMFAULT 1
TEMPLOCK 5
TEMPSET 4
THERMIN 2
AVDD 8
VREF 7
SD 3
NC 6
PIN CONFIGURATION
S
ORDERING GUIDE
+ 0.3 V
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
NC = NO CONNECT
PIN 1
INDICATOR
ADN8830
TOP VIEW
–3–
Package Type
32-Lead LFCSP (ACP)
*
soldered in a 4-layer circuit board for surface-mount packages.
JA
is specified for worst-case conditions, i.e.,
24 COMPOSC
23 PGND
22 N1
21 P1
20 PVDD
19 OUT A
18 COMPSWIN
17 COMPSWOUT
35
JA
*
JA
is specified for a device
10
JC
ADN8830
Package Option
CP-32-1
CP-32-1
CP-32-1
Unit
C/W