LTC3127EDD#TRPBF Linear Technology, LTC3127EDD#TRPBF Datasheet - Page 18

• Manufacturer Part Number: LTC3127EDD#TRPBF
• Description: IC DCDC CONV BUCK BOOST 10DFN
• Manufacturer: Linear Technology

Specifications of LTC3127EDD#TRPBF

• Applications: Energy Harvesting
• Current - Supply: 400µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

package DescripTion
LTC3127

3.55 0.05
2.15 0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
0.25 0.05
1.65 0.05
(2 SIDES)
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
2.38 0.05
(2 SIDES)
(Reference LTC DWG # 05-08-1699 Rev B)
10-Lead Plastic DFN (3mm × 3mm)
0.50
BSC
0.75 0.05
3.00 0.10
DD Package
0.70 0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.125
6
2.38 0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 0.05
0.40 0.10
(DD) DFN REV B 0309
3127f