LTC3108EDE-1#PBF Linear Technology, LTC3108EDE-1#PBF Datasheet - Page 3

• Manufacturer Part Number: LTC3108EDE-1#PBF
• Description: IC VOLTAGE CONVERTER 12-DFN
• Manufacturer: Linear Technology

Specifications of LTC3108EDE-1#PBF

• Applications: Energy Harvesting
• Current - Supply: 3mA
• Voltage - Supply: 20mV ~ 500mV
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 12-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PARAMETER
Output Voltage
V
VAUX Quiescent Current
LDO Output Voltage
LDO Load Regulation
LDO Line Regulation
LDO Dropout Voltage
LDO Current Limit
V
VSTORE Current Limit
VAUX Clamp Voltage
VSTORE Leakage Current
V
VS1, VS2 Threshold Voltage
VS1, VS2 Input Current
PGD Threshold (Rising)
PGD Threshold (Falling)
PGD V
PGD V
PGD Pull-Up Resistance
V
V
V
V
V
V
V
N-Channel MOSFET On-Resistance
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3108-1 is tested under pulsed load conditions such that
T
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3108-1I is guaranteed over the full –40°C to 125°C operating junction
temperature range. Note that the maximum ambient temperature
is determined by specific operating conditions in conjunction with
board layout, the rated thermal package thermal resistance and other
elecTrical characTerisTics
junction temperature range, otherwise specifications are for T
J
OUT
OUT
OUT2
OUT2_EN
OUT2_EN
OUT2
OUT2
OUT2
OUT2
OUT2
≈ T
Quiescent Current
Current Limit
A
Leakage Current
OL
OH
Turn-On Time
Turn-Off Time
Current Limit
Current Limit Response Time
P-Channel MOSFET On-Resistance
. The LTC3108-1E is guaranteed to meet specifications from
Threshold Voltage
Pull-Down Resistance
CONDITIONS
VS1 = VS2 = GND
VS1 = VAUX, VS2 = GND
VS1 = GND, VS2 = VAUX
VS1 = VS2 = VAUX
V
No Load, All Outputs Charged
0.5mA Load
For 0mA to 2mA Load
For VAUX from 2.5V to 5V
I
VLDO = 0V
V
VSTORE = 0V
Current into VAUX = 5mA
VSTORE = 5V
V
VS1 = VS2 = 5V
Measured Relative to the V
Measured Relative to the V
Sink Current = 100µA
Source Current = 0
V
(Note 3)
V
(Note 3)
V
C2 = 5V (Note 3)
VLDO
OUT
OUT
OUT2
OUT2_EN
OUT
OUT
= 3.7V, V
= 0V
= 3.7V
= 3.7V (Note 3)
= 2mA
= 0V, V
Rising
OUT2_EN
OUT2_EN
The
= 0V
= 0V
A
l
= 25°C (Note 2). VAUX = 5V, unless otherwise noted.
OUT
OUT
denotes the specifications which apply over the full operating
Voltage
Voltage
environmental factors. The junction temperature (T
the ambient temperature (T
the formula: T
impedance.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Note 4: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
43°C/W.
Note 5: The absolute maximum rating is a DC rating. Under certain
conditions in the applications shown, the peak AC voltage on the C2 pin
may exceed ±8V. This behavior is normal and acceptable because the
current into the pin is limited by the impedance of the coupling capacitor.
J
= T
A
+ (P
D
• θ
A
) and power dissipation (P
JA
l
l
l
l
l
l
l
l
l
l
l
l
l
°C/W), where θ
3.626
2.134
2.45
2.94
4.41
0.15
MIN
2.8
2.8
0.4
2.1
0.4
4
5
JA
LTC3108-1
2.50
3.00
3.70
4.50
0.05
5.25
0.85
0.01
–7.5
0.15
0.15
TYP
100
350
0.2
2.2
0.5
4.5
4.5
0.1
0.1
2.2
0.3
1.3
0.5
11
–9
is the package thermal
6
1
1
5
5
J
) is calculated from
D
) according to
3.774
2.266
MAX
2.55
3.06
4.59
5.55
0.45
200
0.2
0.3
1.2
0.1
0.3
2.3
1.3
9
1
7
7
UNITS
31081f

MΩ
MΩ
mV
mA
mA
mA
µA
µA
µA
µA
µA
µs
µs
ns
%
%
%
%
Ω
Ω
V
V
V
V
V
V
V
V
V
V
A