IR3088AMTRPBF International Rectifier, IR3088AMTRPBF Datasheet - Page 30
![IC XPHASE W/FAULT DET 20L-MLPQ](/photos/7/48/74806/20_mlpq_sml.jpg)
IR3088AMTRPBF
Manufacturer Part Number
IR3088AMTRPBF
Description
IC XPHASE W/FAULT DET 20L-MLPQ
Manufacturer
International Rectifier
Series
XPhase™r
Datasheet
1.IR3088AMTRPBF.pdf
(33 pages)
Specifications of IR3088AMTRPBF
Applications
Processor
Current - Supply
10mA
Voltage - Supply
8.4 V ~ 14 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-MLPQ
Pin Count
20
Mounting
Surface Mount
Package Type
MLPQ
Case Length
4mm
Case Height
0.88mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3088AMTRPBF
IR3088AMTRPBFTR
IR3088AMTRPBFTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR3088AMTRPBF
Manufacturer:
IR
Quantity:
20 000
PCB Metal and Component Placement
• Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥
• Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm
• Center pad land length and width should be equal to maximum part pad length and width. However, the
• Four 0.3mm diameter vias shall be placed in the pad land spaced at 1.2mm, and connected to ground to
• No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so can
Page 30 of 33
0.2mm to minimize shorting.
inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard
extension will accommodate any part misalignment and ensure a fillet.
minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥
0.23mm for 3 oz. Copper)
minimize the noise effect on the IC and to transfer heat to the PCB.
cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
IR3088APbF
May 18, 2009