LTC3108IGN#PBF Linear Technology, LTC3108IGN#PBF Datasheet - Page 20

no-image

LTC3108IGN#PBF

Manufacturer Part Number
LTC3108IGN#PBF
Description
IC CONV BOOST PROG 4.5MA 16SSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC3108IGN#PBF

Applications
Energy Harvesting
Current - Supply
3mA
Voltage - Supply
20mV ~ 500mV
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SSOP
Primary Input Voltage
500mV
No. Of Outputs
3
Output Voltage
5V
Output Current
300mA
No. Of Pins
16
Operating Temperature Range
-40°C To +85°C
Msl
MSL 1 - Unlimited
Supply Voltage Min
20mV
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC3108IGN#PBFLTC3108IGN
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC3108IGN#PBFLTC3108IGN#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC3108IGN#PBFLTC3108IGN-1
Manufacturer:
LT
Quantity:
10 000
package DescripTion
LTC3108
0
3.60 0.05
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2.20 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70 0.05
0.25 0.05
(0.178 – 0.249)
.007 – .0098
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
3.30 0.05
2.50 REF
.254 MIN
.0165 .0015
RECOMMENDED SOLDER PAD LAYOUT
0.50 BSC
(0.406 – 1.270)
.016 – .050
(MILLIMETERS)
0.70 0.05
INCHES
PACKAGE
OUTLINE
16-Lead Plastic SSOP (Narrow .150 Inch)
.150 – .165
.045 .005
TOP MARK
0 – 8 TYP
(NOTE 6)
12-Lead Plastic DFN (4mm × 3mm)
(0.38 0.10)
.015 .004
.0250 BSC
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
(Reference LTC DWG # 05-08-1695)
PIN 1
(Reference LTC DWG # 05-08-1641)
0.200 REF
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
UE/DE Package
ON THE TOP AND BOTTOM OF PACKAGE
45
GN Package
4.00 0.10
(2 SIDES)
(0.203 – 0.305)
(5.817 – 6.198)
.229 – .244
.008 – .012
TYP
.0532 – .0688
(1.35 – 1.75)
16 15 14 13
1
3.00 0.10
0.75 0.05
(2 SIDES)
2 3
(4.801 – 4.978)
.189 – .196*
0.00 – 0.05
4
R = 0.05
12 11 10 9
5 6 7
TYP
(0.635)
.0250
BSC
(0.102 – 0.249)
BOTTOM VIEW—EXPOSED PAD
1.70 0.10
8
0.25 0.05
.004 – .0098
6
7
(3.810 – 3.988)
R = 0.115
.150 – .157**
GN16 (SSOP) 0204
(0.229)
3.30 0.10
.009
2.50 REF
REF
TYP
0.50 BSC
12
1
0.40 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
(UE12/DE12) DFN 0806 REV D
3108fa

Related parts for LTC3108IGN#PBF