LTC4355IMS#TRPBF Linear Technology, LTC4355IMS#TRPBF Datasheet - Page 17

• Manufacturer Part Number: LTC4355IMS#TRPBF
• Description: IC IDEAL DIODE-OR DUAL 16-MSOP
• Manufacturer: Linear Technology

Specifications of LTC4355IMS#TRPBF

• Applications: -48V Dist Power Systems, AdvancedTCA ® Systems
• Fet Type: N-Channel
• Number Of Outputs: 2
• Internal Switch(s): No
• Delay Time - Off: 300ns
• Voltage - Supply: 9 V ~ 80 V
• Current - Supply: 2mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Delay Time - On: -

PACKAGE DESCRIPTION
3.60 ±0.05
(SEE NOTE 6)
2.20 ±0.05
TOP MARK
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PACKAGE OUTLINE MO-229
TOP AND BOTTOM OF PACKAGE
1.70 ± 0.05
3.30 ±0.05
4.00 ±0.10
(2 SIDES)
3.00 REF
(Reference LTC DWG # 05-08-1708 Rev B)
14-Lead Plastic DFN (4mm × 3mm)
0.50 BSC
0.25 ± 0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
0.70 ±0.05
PACKAGE
OUTLINE
DE Package
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
7
1.70 ± 0.10
8
3.30 ±0.10
3.00 REF
R = 0.115
TYP
0.50 BSC
0.25 ± 0.05
14
1
0.40 ± 0.10
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
LTC4355
17
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