A3959SLP Allegro Microsystems Inc, A3959SLP Datasheet - Page 8

• Manufacturer Part Number: A3959SLP
• Description: IC MOTOR DRVR PWM FULL 28TSSOP
• Manufacturer: Allegro Microsystems Inc

Specifications of A3959SLP

• Applications: PWM Motor Driver
• Number Of Outputs: 1
• Current - Output: ±3A
• Voltage - Load: 9.5 V ~ 50 V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Operating Current: 10mA
• Operating Temperature Classification: Commercial
• Package Type: TSSOP EP
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

A3959
Current Sensing. To minimize inaccuracies in
sensing the I
ground trace IR drops, the sense resistor should have an
independent ground return to the ground terminal of the
device. For low-value sense resistors the IR drops in the
PCB sense resistor’s traces can be signifi cant and should
be taken into account. The use of sockets should be
avoided as they can introduce variation in R
contact resistance.
The maximum value of R
Thermal Protection. Circuitry turns off all drivers
when the junction temperature reaches 165°C typically. It
is intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits are permitted. Thermal shutdown has
a hysteresis of approximately 15°C.
TRIP
current level, which may be caused by
S
is given as R
FUNCTIONAL DESCRIPTION (continued)
S
= 0.5/I
S
due to their
DMOS Full-Bridge PWM Motor Driver
TRIP
.
Layout. A star ground system located close to the driver
is recommended. The printed wiring board should use a
heavy ground plane. For optimum electrical and thermal
performance, the driver should be soldered directly onto
the board. The ground side of R
vidual path to the ground terminals of the device. This path
should be as short as is possible physically and should not
have any other components connected to it. It is recom-
mended that a 0.1 μF capacitor be placed between SENSE
and ground as close to the device as possible; the load sup-
ply terminal, V
ic capacitor (> 47 μF is recommended) placed as close to
the device as is possible. On the 28-lead TSSOP package,
the copper ground plane located under the exposed thermal
pad is typically used as a star ground.
BB
, should be decoupled with an electrolyt-
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
S
should have an indi-
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