EL7457CU Intersil, EL7457CU Datasheet - Page 6

• Manufacturer Part Number: EL7457CU
• Description: IC DVR CMOS QUAD 40MHZ 16-QSOP
• Manufacturer: Intersil
• Type: High Side/Low Side Driverr

Specifications of EL7457CU

• Configuration: High or Low Side
• Input Type: Non-Inverting
• Delay Time: 14.5ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 4
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Current - Output / Channel: 100mA
• On-state Resistance: 3 Ohm
• Current - Peak Output: 2A
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Typical Performance Curves
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 9. SUPPLY CURRENT PER CHANNEL vs
FIGURE 7. PROPAGATION DELAY vs TEMPERATURE
2.5
1.5
0.5
18
16
14
12
10
12
10
8
6
8
6
4
2
0
100
3
2
1
0
-50
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
893mW
2.500W
1.250W
C
V
V
V
f=100kHz
CAPACITIVE LOAD
TEMPERATURE
QSOP16 (0.150”)
L
S
S
S
θ
=1000pF
+=15V
+=V
-=V
JA
-25
25
=112°C/W
L
H
=0V
=10V
AMBIENT TEMPERATURE (°C)
LOAD CAPACITANCE (pF)
0
TEMPERATURE (°C)
50
θ
JA
QFN16
=40°C/W
t
t
25
D2
D1
6
1K
75
85
50
SO16 (0.150”)
θ
100
JA
75
=80°C/W
(Continued)
125
100
10K
125
150
EL7457
FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT
140
120
100
1.2
0.8
0.6
0.4
0.2
80
60
40
20
0
100
1
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
FIGURE 8. RISE/FALL TIME vs LOAD
909mW
667mW
633mW
QSOP16 (0.150”)
V
TEMPERATURE
S
θ
JA
+=15V
=158°C/W
25
470
AMBIENT TEMPERATURE (°C)
LOAD CAPACITANCE (pF)
50
SO16 (0.150”)
θ
JA
1K
=110°C/W
75
85
2.2K
t
θ
F
JA
100
QFN16
=150°C/W
t
R
4.7K
125
January 3, 2005
10K
150
FN7288.3