SI8235BD-C-IS Silicon Laboratories Inc, SI8235BD-C-IS Datasheet - Page 41

• Manufacturer Part Number: SI8235BD-C-IS
• Description: IC DUAL LOW SIDE DRIVER 16SOIC
• Manufacturer: Silicon Laboratories Inc

Specifications of SI8235BD-C-IS

• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 60ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 6.5 V ~ 24 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Number Of Channels: 2
• Propagation Delay Time: 30 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Power Dissipation: 1.2 W
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1897-5

9. Package Outline: 16-Pin Narrow Body SOIC
Figure 46 illustrates the package details for the Si823x in a 16-pin narrow-body SOIC (SO-16). Table 20 lists the
values for the dimensions shown in the illustration.
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
A1
A2
E1
Components.
A
D
E
b
c
e
Figure 46. 16-pin Small Outline Integrated Circuit (SOIC) Package
0.10
1.25
0.31
0.17
Min
—
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
Table 20. Package Diagram Dimensions
Max
1.75
0.25
0.51
0.25
—
Rev. 1.1
Dimension
aaa
bbb
ddd
ccc
L2
L
h
θ
0.40
0.25
Min
0°
0.25 BSC
0.10
0.20
0.10
0.25
Max
1.27
0.50
Si823x
8°
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