MAX15019BASA+ Maxim Integrated Products, MAX15019BASA+ Datasheet - Page 7

• Manufacturer Part Number: MAX15019BASA+
• Description: IC MOSF DRVR HALF BRDG HS 8-SOIC
• Manufacturer: Maxim Integrated Products
• Type: High Side/Low Sider

Specifications of MAX15019BASA+

• Configuration: Half Bridge
• Input Type: Inverting and Non-Inverting
• Delay Time: 36ns
• Current - Peak: 3A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 125V
• Voltage - Supply: 8 V ~ 12.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
• Rise Time: 50 ns
• Fall Time: 40 ns
• Supply Voltage (min): 8 V
• Supply Current: 2.75 mA
• Maximum Power Dissipation: 1904 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Maximum Turn-off Delay Time: 36 ns
• Maximum Turn-on Delay Time: 36 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

(T
A
= +25°C, unless otherwise noted.)
PIN
—
1
2
3
4
5
6
7
8
DELAY MATCHING (DH AND DL RISING)
NAME
IN_H
GND
IN_L
V
BST
DH
HS
DL
EP
DD
_______________________________________________________________________________________
_______________________________________________________________________________________
Input Supply Voltage. Valid supply voltage ranges from 8V to 12.6V. Bypass V
combination of 0.1µF and 1µF ceramic capacitors as close to the IC as possible.
Boost Flying Capacitor Connection. Connect a 0.22µF ceramic capacitor from BST to HS as close to the IC
as possible for the high-side MOSFET driver supply.
High-Side Gate Driver Output. Driver output for the high-side MOSFET gate.
Source Connection for High-Side MOSFET. Also serves as the return for the high-side driver.
High-Side Noninverting Logic Input
Low-Side Noninverting (MAX15018A/MAX15019A) or Low-Side Inverting (MAX15018B/MAX15019B) Input
Ground. Use GND as a return path to the DL driver output and the IN_H, IN_L inputs. Must be connected to
ground.
Low-Side Gate Driver Output. Driver output for the low-side MOSFET gate.
Exposed Pad. Internally connected to GND. Externally connect the exposed pad to a large ground plane to
aid in heat dissipation. Grounding EP does not substitute the requirement to connect GND to ground.
10ns/div
C
MAX15018 toc18
L
= 0pF
V
10V/div
V
10V/div
IN_
DH
Typical Operating Characteristics (continued)
AND V
DL
Half-Bridge MOSFET Drivers
FUNCTION
125V/3A, High-Speed,
V
V
V
DH_
V
IN_
DD
DL
RESPONSE TO V
40µs/div
DD
DD
to GND with a parallel
Pin Description
GLITCH
MAX15018 toc19
10V/div
10V/div
10V/div
10V/div
7
7