LM5106MM/NOPB National Semiconductor, LM5106MM/NOPB Datasheet - Page 9

IC DVR HALF-BRIDGE HV 10-MSOP

LM5106MM/NOPB

Manufacturer Part Number
LM5106MM/NOPB
Description
IC DVR HALF-BRIDGE HV 10-MSOP
Manufacturer
National Semiconductor
Datasheet

Specifications of LM5106MM/NOPB

Configuration
Half Bridge
Input Type
PWM
Delay Time
115ns
Current - Peak
1.8A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
118V
Voltage - Supply
8 V ~ 14 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM5106MM
LM5106MMNOPBTR
LM5106MMNOPBTR
LM5106MMTR

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LM5106MM/NOPB
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1.
2.
HS must always be at a lower potential than HO. Pulling
HO more than -0.3V below HS can activate parasitic
transistors resulting in excessive current flow from the
HB supply, possibly resulting in damage to the IC. The
same relationship is true with LO and VSS. If necessary,
a Schottky diode can be placed externally between HO
and HS or LO and GND to protect the IC from this type
of transient. The diode must be placed as close to the IC
pins as possible in order to be effective.
HB to HS operating voltage should be 15V or less.
Hence, if the HS pin transient voltage is -5V, VDD should
be ideally limited to 10V to keep HB to HS below 15V.
FIGURE 6. LM5106 Driving MOSFETs Connected in Half-Bridge Configuration
9
3.
Low ESR bypass capacitors from HB to HS and from
VCC to VSS are essential for proper operation. The
capacitor should be located at the leads of the IC to
minimize series inductance. The peak currents from LO
and HO can be quite large. Any inductances in series with
the bypass capacitor will cause voltage ringing at the
leads of the IC which must be avoided for reliable
operation.
20175908
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