LP5523TMX/NOPB National Semiconductor, LP5523TMX/NOPB Datasheet
LP5523TMX/NOPB
Specifications of LP5523TMX/NOPB
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LP5523TMX/NOPB Summary of contents
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... The LP5523 is available in a tiny 25–bump 2. 2. 0.60 mm micro SMD package (0.4 mm pitch). Notice: This document is not a full datasheet. For more information regarding this product or to order samples, please contact your local National Semiconductor sales office or visit http://www.national.com/support/dir.html. Typical Application © 2009 National Semiconductor Corporation ...
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Connection Diagrams and Package Mark Information Connection Diagrams Thin micro SMD 25–bump package, 2.27 x 2.27 x 0.60 mm body size, 0.4 mm pitch NS Package Number TMD25LLA Top View Package Mark Top View: XY — Date Code TT — ...
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... The dimension for X1, X2 and X3 are as given: — 2.27 mm ±0.03 mm — 2.27 mm ±0.03 mm — 0.60 mm ±0.075 mm See National Semiconductor Application Note 1112 Micro SMD Wafer Level Chip Scale Package for PCB design and assembly instructions. NS Package Number TMD25LLA 25–bump micro SMD 3 www.national.com ...
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