AS1109-BSSU austriamicrosystems, AS1109-BSSU Datasheet - Page 4

• Manufacturer Part Number: AS1109-BSSU
• Description: IC LED 4-BIT CC DRIVER 16-SSOP
• Manufacturer: austriamicrosystems
• Type: General Purposer

Specifications of AS1109-BSSU

• Constant Current: *
• Constant Voltage: *
• Topology: *
• Number Of Outputs: *
• Internal Driver: *
• Type - Primary: *
• Type - Secondary: *
• Frequency: *
• Voltage - Supply: *
• Voltage - Output: *
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Operating Temperature: *
• Current - Output / Channel: *
• Internal Switch(s): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Efficiency: -

AS1109
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
the device at these or any other conditions beyond those indicated in
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
* Min/max values are load dependent.
www.austriamicrosystems.com/LED-Driver-ICs/AS1109
Electrical Parameters
Electrostatic Discharge
Temperature Ranges and Storage Conditions
Input Current (latch-up immunity)
Electrostatic Discharge HBM
Storage Temperature Range
Package Body Temperature
Humidity non-condensing
Thermal Resistance Θ
Moisture Sensitive Level
GND Pin Current
Output Voltage
Input Voltage
VDD to GND
Parameter
Table 2
JA
may cause permanent damage to the device. These are stress ratings only, and functional operation of
-100
Min
-0.3
-0.4
-0.4
-55
5
113
33
32
2
1
V
DD
1000
+150
+260
Revision 1.20
Max
100
15
85
7
Section 6 Electrical Characteristics on page 5
+ 0.4
Units
ºC/W
ºC/W
ºC/W
mA
mA
kV
ºC
ºC
%
V
V
V
The lead finish for Pb-free leaded packages is matte tin
Classification for Non-Hermetic Solid State Surface
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
The reflow peak soldering temperature (body
Represents a max. floor life time of unlimited
on PCB, 16-pin QFN (4x4mm) package
on PCB, 16-pin QSOP-150 package
on PCB, 16-pin SOIC-150 package
Norm: MIL 883 E method 3015
Norm: JEDEC 78
Mount Devices”.
Comments
(100% Sn).
is not implied. Exposure to
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