BD1604MUV-E2 Rohm Semiconductor, BD1604MUV-E2 Datasheet - Page 4

• Manufacturer Part Number: BD1604MUV-E2
• Description: IC LED DRVR WHITE BCKLGT 16-VQFN
• Manufacturer: Rohm Semiconductor
• Type: Backlight, White LEDr

Specifications of BD1604MUV-E2

• Topology: PWM, Switched Capacitor (Charge Pump)
• Number Of Outputs: 4
• Internal Driver: Yes
• Type - Primary: Backlight
• Type - Secondary: White LED
• Frequency: 800kHz ~ 1.2MHz
• Voltage - Supply: 2.7 V ~ 5.5 V
• Voltage - Output: 4.5V
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN
• Operating Temperature: -30°C ~ 85°C
• Current - Output / Channel: 30mA
• Internal Switch(s): Yes
• Number Of Segments: 4
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Power Dissipation: 700 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 30 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Efficiency: -
• Lead Free Status / Rohs Status: Details
• Other names: BD1604MUV-E2TR

○Cautions on use
(1) Absolute Maximum Ratings
(2) Power supply and GND line
(3) GND voltage
(4) Short circuit between terminals and erroneous mounting
(5) Operation in strong electromagnetic field
(6) Input terminals
(7) External capacitor
(8) Thermal shutdown circuit (TSD)
(9) Thermal design
(10) Other cautions on use
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions,
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an
open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be
given to take physical safety measures including the use of fuses, etc.
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies
and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current
included the external circuits, please separate each GND pattern. Furthermore, for all power supply terminals
to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a
capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem
including the occurrence of capacity dropout at a low temperature, thus determining the constant.
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating
state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an
actual electric transient.
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering
between terminals or between the terminal and the power supply or the GND terminal, the ICs can break
down.
Be noted that using ICs in the strong electromagnetic field can malfunction them.
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation
of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to
a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature,
etc.
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection
temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal
shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not
aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this
circuit operating or use the LSI assuming its operation.
Perform thermal design in which there are adequate margins by taking into account the permissible
dissipation (Pd) in actual states of use.
Please consult supplementary documents such as technical notebook, function manual and
application design guide of this LSI.
REV. B
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