MAX3738ETG+T Maxim Integrated Products, MAX3738ETG+T Datasheet - Page 14

• Manufacturer Part Number: MAX3738ETG+T
• Description: IC LASER DRIVER 4.25GBPS 24TQFN
• Manufacturer: Maxim Integrated Products
• Type: Laser Diode Driver (Fiber Optic)r

Specifications of MAX3738ETG+T

• Data Rate: 4.25Gbps
• Number Of Channels: 1
• Voltage - Supply: 2.97 V ~ 3.63 V
• Current - Supply: 47mA
• Current - Modulation: 85mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-TQFN Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

155Mbps to 4.25Gbps SFF/SFP Laser Driver
with Extinction Ratio Control
To minimize loss and crosstalk, keep the connections
between the MAX3738 output and the laser diode as
short as possible. Use good high-frequency layout
techniques and multilayer boards with uninterrupted
ground plane to minimize EMI and crosstalk. Circuit
boards should be made using low-loss dielectrics. Use
controlled-impedance lines for data inputs, as well as
the module output.
Using the MAX3738 laser driver alone does not ensure
that a transmitter design is IEC 825 compliant. The
entire transmitter circuit and component selections must
be considered. Each customer must determine the level
of fault tolerance required by their application, recogniz-
ing that Maxim products are not designed or authorized
for use as components in systems intended for surgical
implant into the body, for applications intended to sup-
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Laser Safety and IEC 825
Layout Considerations
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
The exposed pad on the 24-pin TQFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3738 and
should be soldered to the circuit board ground for proper
thermal and electrical performance. Refer to Maxim
Application Note 862: HFAN-08.1: Thermal Considerations
of QFN and Other Exposed-Paddle Packages at
www.maxim-ic.com
TRANSISTOR COUNT: 3754
PROCESS: SiGe/BiPOLAR
Exposed-Pad (EP) Package
for additional information.
Chip Information