MC34653EF Freescale Semiconductor, MC34653EF Datasheet - Page 4

• Manufacturer Part Number: MC34653EF
• Description: IC CTRLR HOT SWAP NEG V 8-SOIC
• Manufacturer: Freescale Semiconductor
• Type: Hot-Swap Switchr

Specifications of MC34653EF

• Applications: General Purpose
• Internal Switch(s): Yes
• Current Limit: 1A
• Voltage - Supply: 36 V ~ 80 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2. Maximum Ratings
permanent damage to the device.
4
34653
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Power Supply Voltage
Power MOSFET Energy Capability
Continuous Output Current
Maximum Voltage
All Pins Minimum Voltage
PG,
ESD Voltage, All Pins
Storage Temperature
Operating Temperature
Peak Package Reflow Temperature During Reflow
Thermal Resistance
10.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
5.
6.
7.
8.
9.
DISABLE Pin
ILIM and ICHG Pins
PG Pin (V
PG
Human Body Model
Machine Model
Ambient
Junction
Junction-to-Ambient, Single-Layer Board
Junction-to-Ambient, Four-Layer Board
PG
Refer to the section titled
Continuous output current capability so long as T
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Refer to the section titled
The VOUT and VIN pins comprise the main heat conduction paths.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.
Pin (V
Maximum Current
(4)
PG
PG
- V
- V
IN
IN
(7)
)
)
(3)
,
(8)
(2)
Power MOSFET Energy Capability on page 21
Thermal Shutdown on page 15
Ratings
ELECTRICAL CHARACTERISTICS
(10)
(9)
ZAP
= 200 pF, R
(5)
,
(6)
J
MAXIMUM RATINGS
is ≤ 160
ZAP
for more thermal resistance values under various conditions.
= 0 Ω).
°
C.
for a detailed explanation on this parameter.
ZAP
= 100 pF, R
E
I
Symbol
O (CONT
V
V
R
V
MOSFET
T
T
R
ESD3
ESD4
PPRT
θ
PWR
T
—
—
—
—
STG
T
—
—
θ
JMA
A
J
JA
)
ZAP
Analog Integrated Circuit Device Data
= 1500 Ω), ESD2 testing is performed in
V
IN
Internally Limited
- 0.3 to V
- 65 to 150
- 40 to 160
Varies
- 40 to 85
± 2000
Value
Note 6
± 200
- 0.3
167
115
1.0
5.0
85
85
85
Freescale Semiconductor
PWR
(1)
+ 5.5
°C/W
Unit
mJ
°C
°C
°C
V
A
V
V
A
V