MM58201N National Semiconductor, MM58201N Datasheet - Page 2

• Manufacturer Part Number: MM58201N
• Description: IC LCD DRIVER DOT MATRIX 40DIP
• Manufacturer: National Semiconductor

Specifications of MM58201N

• Display Type: LCD
• Configuration: 24 Segment
• Interface: Serial
• Current - Supply: 300µA
• Voltage - Supply: 7 V ~ 18 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Digits Or Characters: -
• Other names: *MM58201N

Absolute Maximum Ratings
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Voltage at Any Pin
Operating Temperature Range
Storage Temperature Range
DC Electrical Characteristics
AC Electrical Characteristics
Symbol
I
V
V
V
I
I
I
V
V
Z
Z
is the number of backplanes programmed
CC
OUT(1)
IN(1)
IN(0)
Symbol
f
f
t
t
t
t
t
t
t
OSC
CLK IN
ON
OFF
S
H
ACC
r
f
IN(1)
IN(0)
OUT(0)
TC
TC
OUT
OUT
Quiescent Supply Current
Logical ‘‘1’’ Input Voltage
Logical ‘‘0’’ Input Voltage
Logical ‘‘0’’ Output Voltage
Logical ‘‘1’’ Output Leakage
Current
Logical ‘‘1’’ Input Leakage
Current
Logical ‘‘0’’ Input Leakage
Current
Input Voltage
Input Impedance
Output Impedance
DC Offset Voltage
Oscillator Frequency
Clock Frequency
Clock Pulse Width
Clock OFF Time
Input Data Set-Up Time
Input Data Hold Time
Access Time
Rise Time
Fall Time
Parameter
Parameter
V
SS
b
0 3V to V
b
65 C to
Backplane Segment Outputs
C
Backplane Segment Outputs
C
0 C to 70 C
I
V
V
V
Backplane and Segment
Outputs
Between Any Backplane
and Segment Output
L
L
Min max limits apply across temperature range unless otherwise noted
T
SINK
OUT
IN
IN
SS
A
e
e
a
and V
e
e
2000 pF
2000 pF
a
150 C
e
e
Conditions
V
V
18V
Conditions
DD
SS
0 6 mA
V
DD
DD
within operating range unless otherwise noted
2
Power Dissipation at 25 C
Operating V
Lead Temperature (Soldering
10 seconds)
Molded DIP Package board mount
Molded DIP Package board mount
Molded DIP Package socket mount
derate 23 3m W C above 25 C
Molded DIP Package socket mount
derate 21 3m W C above 25 C
DD
0 45 V
V
SS
b
Min
4 5
Range
10
b
0
0
0
1 0
128
Min
DC
5 0
5 0
2 0
1 0
5 0
0 3
DD
Typ
Typ
V
SS
a
V
V
DD
7 0V to V
DD
Max
g
g
400
0 3
1 0
0 4
1 0
Max
30
10
100
0
60
60
a
a
10
10
0 3
0 3
JA
JA
e
e
SS
43 C W
47 C W
a
2 6W
2 9W
Units
300 C
18 0V
Units
kHz
Hz
mA
mV
k
k
V
V
V
V
s
s
s
s
s
s
s
A
A
A