LT3092ETS8#TRMPBF Linear Technology, LT3092ETS8#TRMPBF Datasheet - Page 19

• Manufacturer Part Number: LT3092ETS8#TRMPBF
• Description: IC CURRENT SOURCE 1% TSOT23-8
• Manufacturer: Linear Technology

Specifications of LT3092ETS8#TRMPBF

• Function: Current Source
• Accuracy: ±1%
• Voltage - Input: 1.2 ~ 40 V
• Current - Output: 200mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-8, TSOT-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sensing Method: -
• Other names: LT3092ETS8#TRMPBFTR

PACKAGE DESCRIPTION
3.5 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
2.15 ±0.05
(6.70 – 7.30)
.264 – .287
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(3.30 – 3.71)
.130 – .146
(1.80)
.071
MAX
(2.30)
.0905
BSC
2.38 ±0.05
(2 SIDES)
0.50 BSC
(6.30 – 6.71)
(2.90 – 3.15)
(0.60 – 0.84)
.248 – .264
.114 – .124
.024 – .033
(4.60)
0.675 ±0.05
.181
BSC
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1630)
TOP MARK
3-Lead Plastic SOT-223
(NOTE 6)
PIN 1
0.200 REF
DD Package
ST Package
(0.84 – 1.04)
.033 – .041
(0.31)
.012
MIN
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
MAX
10
.059 MAX
10 – 16
.059 MAX
RECOMMENDED SOLDER PAD LAYOUT
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
(0.0203 – 0.1016)
0.00 – 0.05
.0008 – .0040
.129 MAX
.181 MAX
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
.039 MAX
0.25 ± 0.05
R = 0.115
10 – 16
.090
BSC
TYP
4
5
.248 BSC
ST3 (SOT-233) 0502
2.38 ±0.10
(2 SIDES)
(0.25 – 0.36)
.010 – .014
LT3092
8
1
0.50 BSC
0.38 ± 0.10
19
(DD) DFN 1203
3092fb