LNK354G Power Integrations, LNK354G Datasheet - Page 13
![IC OFFLINE SWIT OCP HV 8SMD](/photos/7/32/73209/596-8-bsmd_sml.jpg)
LNK354G
Manufacturer Part Number
LNK354G
Description
IC OFFLINE SWIT OCP HV 8SMD
Manufacturer
Power Integrations
Series
LinkSwitch®-HFr
Datasheet
1.LNK353GN-TL.pdf
(16 pages)
Specifications of LNK354G
Output Isolation
Isolated
Frequency Range
186 ~ 214kHz
Voltage - Output
700V
Power (watts)
5W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-SMD Gull Wing, 7 Leads
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LNK354G
Manufacturer:
SAMSUNG
Quantity:
6 229
Company:
Part Number:
LNK354GN
Manufacturer:
POWER
Quantity:
15 000
.240 (6.10)
.260 (6.60)
.100 (2.54) BSC
.125 (3.18)
.145 (3.68)
-T-
.032 (.81)
.037 (.94)
Pin 1
-E-
.125 (3.18)
.145 (3.68)
-D-
.240 (6.10)
.260 (6.60)
SEATING
PLANE
Pin 1
-E-
-D-
.014 (.36)
.022 (.56)
⊕
.367 (9.32)
.387 (9.83)
D S .004 (.10)
⊕
D S .004 (.10)
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
⊕
T E D S .010 (.25) M
.048 (1.22)
.053 (1.35)
.137 (3.48)
.009 (.23)
MINIMUM
⊕
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
E S
.120 (3.05)
.140 (3.56)
.057 (1.45)
.068 (1.73)
.057 (1.45)
.068 (1.73)
MINIMUM
(NOTE 6)
.015 (.38)
(NOTE 5)
.010 (.25)
SMD-8B
DIP-8B
.004 (.10)
.012 (.30)
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Pin 1
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
Solder Pad Dimensions
.004 (.10)
.046 .060
.008 (.20)
.015 (.38)
.086
.300 (7.62) BSC
.186
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
.286
(NOTE 7)
.060 .046
.080
.420
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
LNK353/354
PI-2546-121504
PI-2551-121504
G08B
P08B
2/05
F
13