TOP223G Power Integrations, TOP223G Datasheet - Page 10

• Manufacturer Part Number: TOP223G
• Description: IC OFFLINE SWIT PWM OCP HV 8SMD
• Manufacturer: Power Integrations
• Series: TOPSwitch®-IIr
• Type: Off Line Switcherr

Specifications of TOP223G

• Output Isolation: Isolated
• Frequency Range: 90 ~ 110kHz
• Voltage - Output: 700V
• Power (watts): 25W
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 8-SMD Gull Wing
• Output Voltage: 5.7 V
• Input / Supply Voltage (max): 265 VAC
• Input / Supply Voltage (min): 85 VAC
• Duty Cycle (max): 70 %
• Switching Frequency: 100 KHz
• Supply Current: 1.2 mA
• Operating Temperature Range: - 40 C to + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Output
Frequency
Maximum
Duty Cycle
Minimum
Duty Cycle
PWM
Gain
PWM Gain
Temperature Drift
External
Bias Current
Dynamic
Impedance
Dynamic Impedance
Temperature Drift
CONTROL Pin
Charging Current
Charging Current
Temperature Drift
10
CONTROL FUNCTIONS
SHUTDOWN/AUTO-RESTART
TOP221-227
DRAIN Voltage ............................................ -0.3 to 700 V
DRAIN Current Increase ( I
blanking time ......................................... 0.1 x I
CONTROL Voltage ..................................... - 0.3 V to 9 V
CONTROL Current ............................................... 100 mA
Storage Temperature ..................................... -65 to 150 C
Notes:
1. All voltages referenced to SOURCE, T
2. Related to transformer saturation – see Figure 13.
3. Normally limited by internal circuitry.
4. 1/16" from case for 5 seconds.
Parameter
D
7/01
Symbol
D
D
D
f
OSC
Z
I
I
) in 100 ns except during
MAX
MIN
B
C
C
ABSOLUTE MAXIMUM RATINGS
SOURCE = 0 V
I
C
A
(Unless Otherwise Specified)
= I
= 25 C.
I
C
CD1
I
I
I
= 10 mA, See Figure 10
LIMIT(MAX)
T
C
C
C
J
+ 0.4 mA, See Figure 10
= 4 mA, T
= 4 mA, T
= 4 mA, T
= 25 C
Conditions
See Figure 14
See Figure 11
See Figure 4
See Figure 4
See Note A
See Note A
(2)
;
T
J
J
J
J
= -40 to 125 C
Operating Junction Temperature
Lead Temperature
Thermal Impedance: Y Package (
5. Free standing with no heatsink.
6. Measured at tab closest to plastic interface or SOURCE pin.
7. Soldered to 0.36 sq. inch (232 mm
8. Soldered to 1 sq. inch (645 mm
= 25 C
= 25 C
= 25 C
V
V
C
C
= 0 V
= 5 V
(4)
................................................ 260 C
(1)
P/G Package:
Min
-2.4
-21
0.7
0.8
90
64
10
-2
(
(
JC
JA
)
) .........45 C/W
(6)
2
-0.05
0.18
), 2 oz. (610 gm/m
Typ
-1.9
-1.5
(3)
100
-16
2
1.7
2.0
0.4
(
...............................11 C/W
67
15
), 2 oz. (610 gm/m
................ -40 to 150 C
JC
JA
)
)
(6)
(5)
...................2 C/W
.................70 C/W
Max
-1.2
-0.8
110
-11
2.7
3.3
70
22
(7)
; 35 C/W
2
2
) copper clad.
) copper clad.
%/mA/ C
Units
%/mA
%/ C
%/ C
kHz
mA
mA
%
%
(8)