MD2533-D8G-X-P/Y SanDisk, MD2533-D8G-X-P/Y Datasheet - Page 27
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MD2533-D8G-X-P/Y
Manufacturer Part Number
MD2533-D8G-X-P/Y
Description
IC MDOC H3 8GB FBGA
Manufacturer
SanDisk
Type
Flash Disk Moduler
Specifications of MD2533-D8G-X-P/Y
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
8G (1G x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
115-LFBGA
Density
1GByte
Operating Supply Voltage (typ)
1.8/3.3V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Package Type
FBGA
Mounting
Surface Mount
Pin Count
115
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.65/2.7V
Operating Supply Voltage (max)
1.95/3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
3.2.3
The Serial interface (SPI) provides mDOC H3 a secondary interface with debug and
programming capabilities. mDOC H3 SPI Interface is configured as Slave. All four combinations
of clock phase (CPHA) and clock polarity (CPOL) defined by the SPI specification are supported.
The Serial interface supports two usage scenarios:
1. Debug port: Allowing the host with an SPI interface to read debug messages.
2. Format and Program port: Allowing a programmer to use this port in order to format and
program the device.
The serial protocol debug port provides a means for the serial interface (SPI Slave) to queue and
transmit debug messages to a host which supports an SPI interface.
All transfers are performed in multiples of 8 bits, with the MSB of each byte transmitted first.
3.3
3.3.1 Host Protocol
Block of registers and logic required for implementing block device operations over the host
interface. This block implements a set of complex transactions required for operating the mDOC
H3 device. These transactions include data storage operations as well as device configuration and
management.
3.3.2 Boot Block (XIP)
The Programmable Boot Block with XIP functionality enables mDOC H3 to act as a boot device
(in addition to performing flash disk data storage functions). This eliminates the need for
expensive, legacy NOR flash or any other boot device on the motherboard.
The Programmable Boot Block is 32KB in size. The Boot Agent, described in the next section,
expands the functionality of this block by copying the boot code from the flash into the boot
block.
3.4
Upon power-up or when the RSTIN# signal is de-asserted, the Boot Agent automatically
downloads the Initial Program Loader (IPL) to the Programmable Boot Block. The IPL contains
the code for starting the Host boot process. The download process is quick, and is designed so that
when the CPU accesses mDOC H3 for code execution, the IPL code is already located in the
Programmable Boot Block. During the download process, mDOC H3 does not respond to read or
write accesses. Host systems must therefore observe the requirements described in Section
10.3.10.
During the download process, mDOC H3 asserts the BUSY# signal to indicate to the system that
it is not yet ready to be accessed. Once BUSY# is de-asserted, the system can access mDOC H3.
Note that after IPL is loaded and BUSY# is de-asserted, the Boot Agent continues to download
the embedded TrueFFS from Flash to the mDOC H3 internal RAM, and then executes it.
Downloading the embedded TrueFFS is done in parallel to the host system accessing the IPL
code. During the time between BUSY# signal de-assertion and Embedded TrueFFS load
27
Boot Agent
Serial Interface
Host Agent
Data Sheet (Preliminary) Rev. 0.2
mDOC H3 Embedded Flash Drive
92-DS-1205-10