MD2534-D1G-X-P/Y SanDisk, MD2534-D1G-X-P/Y Datasheet - Page 5
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MD2534-D1G-X-P/Y
Manufacturer Part Number
MD2534-D1G-X-P/Y
Description
IC MDOC H3 1GB 115-BGA
Manufacturer
SanDisk
Datasheet
1.MD2534-D2G-X-PY.pdf
(85 pages)
Specifications of MD2534-D1G-X-P/Y
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
1G (128M x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
115-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Other names
585-1202
MD2534-D1G-X-P-H/Y
MD2534-D1G-X-P-H/Y
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
R
5
92-DS-1205-10
EVISION
Doc. No
H
ISTORY
0.1
0.2
Revision
January 2006
June 2006
Data Sheet (Preliminary) Rev. 0.2
Date
Preliminary version
RSRVD balls left floating changed from
a recommendation to a requirement
Standard I/F Ball H9 changed from
RSRVD to VSS
Ballout change – Some NC balls
removed, resulting in 115 balls for all
products
Ball H2 changed from DPD to A0
Details on internal pull up and pull down
resistors added
DPD signal removed (replaced with A0,
which should be connected to CPU A0
or to VSS)
Balls G1,H1,J1,K1 marked as reserved
Ball G4 changed from RSRVD to
VCCQ
Ball D9 changed from NC to RSRVD
Modes of operation diagram updated
“Normal mode” name changed to
“Turbo mode”
8KB address space settings added
Added register addresses for 8KB
address space
Burst mode can only be used in
conjunction with mDOC H3 DMA
functionality
Operating Conditions updated
Asynchronous boot mode timing
diagram added
Multiplexed timing updated
Power up timing updated
Mechanical drawing updated
(removed balls from 12x18mm drawing)
Ordering information modified
Description
mDOC H3 Embedded Flash Drive
-
Section 2
Section 2.2
Section 2.2
Sections 2.2
and 2.3
Sections 2.2.2
and 2.3.2
Sections 2,
2.2.2 and 2.3.2
Sections 2.2.2
and 2.3.2
Section 2.3.2
Section 5
Section 5
Section 6.5
Section 7
Section 9.8.2
Section 10.2.4
Section 10.3.1
Section 10.3.3
Section 10.3.4
Section 10.3.10
Section 10.4.2
Section 11
Reference
92-DS-1205-10