MD5811-D256-V3Q18-X-P SanDisk, MD5811-D256-V3Q18-X-P Datasheet - Page 16
MD5811-D256-V3Q18-X-P
Manufacturer Part Number
MD5811-D256-V3Q18-X-P
Description
IC MDOC P3 256MB 48-TSOP
Manufacturer
SanDisk
Datasheet
1.MD5811-D256-V3Q18-P.pdf
(86 pages)
Specifications of MD5811-D256-V3Q18-X-P
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
256M (32M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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The following abbreviations are used: IN - Standard (non-Schmidt) input, ST - Schmidt Trigger input, OD - Open drain output, R8 - Nominal
22K pull-up resistor, enabled only for 8-bit interface mode (IF_CFG input is 0)
IRQ#
DPD
VCC
VCCQ
VSS
RSRVD
Signal
See Figure 2
Ball No.
G2, J8
G1
F8
J4
J5
M
A
Input
Type
OD
ST
-
-
-
-
-
-
Device supply. Requires a 10 nF and 0.1 µF
I/O power supply. Sets the logic 1 voltage level
Interrupt Request, active low. A 10 KΩ pull-up
resistor is required if this ball drives an input. A 10
KΩ pull-up resistor is recommended even if this
ball is not used.
Deep Power-Down. Used to enter and exit Deep
Power-Down mode. This ball is assigned A0
instead of DPD when working in 8-bit mode.
capacitor.
range of I/O balls. VCCQ may be either 2.5V to
3.6V or 1.65V to 2.0V. Requires a 10 nF and
0.1 µF capacitor.
Ground. All VSS balls must be connected.
Reserved. All reserved signals are not connected
internally and must be left floating to guarantee
forward compatibility with future products.
Mechanical. These balls are for mechanical
placement, and are not connected internally.
Alignment. This ball is for device alignment and is
not connected internally.
Data Sheet, Rev. 0.3
Power
Other
Description
Mobile DiskOnChip P3
93-SR-009-8L
Supply
Supply
Supply
Signal
Output
Type
Input
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