TC55VBM416AFTN55 Toshiba, TC55VBM416AFTN55 Datasheet

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TC55VBM416AFTN55

Manufacturer Part Number
TC55VBM416AFTN55
Description
IC SRAM 16MBIT 55NS 48TSOP
Manufacturer
Toshiba
Datasheet

Specifications of TC55VBM416AFTN55

Format - Memory
RAM
Memory Type
SRAM
Memory Size
16M (1M x 16)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TC55VBM416AFTN55
Manufacturer:
TOSHIBA
Quantity:
100
Part Number:
TC55VBM416AFTN55
Manufacturer:
TOSHIBA
Quantity:
100
Part Number:
TC55VBM416AFTN55
Manufacturer:
AMD
Quantity:
319
1,048,576-WORD BY 16-BIT/2,097,152-WORD BY 8-BIT FULL CMOS STATIC RAM
DESCRIPTION
by 16 bits/2,097,152 words by 8 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this device
operates from a single 2.3 to 3.6 V power supply. Advanced circuit technology provides both high speed and low
power at an operating current of 3 mA/MHz and a minimum cycle time of 55 ns. It is automatically placed in
low-power mode at 0.9 A standby current (at V
high or (CE2) is asserted low. There are three control inputs. CE1 and CE2 are used to select the device and for
data retention control, and output enable ( OE ) provides fast memory access. Data byte control pin ( LB , UB )
provides lower and upper byte access. This device is well suited to various microprocessor system applications
where high speed, low power and battery backup are required. And, with a guaranteed operating extreme
temperature range of
temperature conditions. The TC55VBM416AFTN is available in a plastic 48-pin thin-small-outline package
(TSOP).
FEATURES
PIN ASSIGNMENT
The TC55VBM416AFTN is a 16,777,216-bit static random access memory (SRAM) organized as 1,048,576 words
Low-power dissipation
Operating: 9 mW/MHz (typical)
Single power supply voltage of 2.3 to 3.6 V
Power down features using CE1 and CE2
Data retention supply voltage of 1.5 to 3.6 V
Direct TTL compatibility for all inputs and outputs
Wide operating temperature range of 40° to 85°C
Standby Current (maximum):
48 PIN TSOP
Pin Name
Pin Name
Pin Name
Pin No.
Pin No.
Pin No.
3.6 V
3.0 V
24
1
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
I/O3
A15
A17
17
33
1
15 A
8 A
(Normal)
I/O11
A14
40° to 85°C, the TC55VBM416AFTN can be used in environments exhibiting extreme
A7
18
34
(TOP VIEW)
2
A13
I/O4
A6
19
35
3
I/O12 V
A12
20
A5
36
4
48
25
A11
A4
21
37
DD
5
I/O5
A10
DD
A3
22
38
6
3 V, Ta
I/O13 I/O6
A9
A2
23
39
7
A8
24
A1
40
8
Access Times (maximum):
Package:
25°C, typical) when chip enable ( CE1 ) is asserted
TSOP Ⅰ 48-P-1220-0.50
Access Time
CE2
CE
OE
I/O14 I/O7
A19
A0
25
41
9
1
PIN NAMES
*: OP pin must be open or connected to GND.
Access Time
Access Time
Access Time
I/O1~I/O16
CE , CE2
CE
NC
A-1~A19
LB , UB
A0~A19
10
26
42
BYTE
GND
R/W
V
1
OP*
1
OE
NC
DD
I/O15 I/O8
GND
R/W
27
43
11
TC55VBM416AFTN55
Address Inputs (Word Mode)
Address Inputs (Byte Mode)
Chip Enable
Read/Write Control
Output Enable
Data Byte Control
Data Inputs/Outputs
Word/Byte Mode Select
Power
Ground
No Connection
Option
CE2
OE
12
28
44
I/O16
I/O1
/A-1
OP
29
45
2003-12-25 1/14
13
(Weight:0.51 g typ)
GND
I/O9
UB
14
30
46
55 ns
55 ns
55 ns
30 ns
BYTE
I/O2
LB
15
31
47
I/O10
A18
A16
16
32
48

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TC55VBM416AFTN55 Summary of contents

Page 1

... I/O12 V I/O5 I/O13 I/O6 I/O14 I/O7 DD TC55VBM416AFTN55 55 ns Access Time 55 ns Access Time 55 ns Access Time 30 ns (Weight:0.51 g typ) A0~A19 Address Inputs (Word Mode) A-1~A19 Address Inputs (Byte Mode CE2 1 Chip Enable R/W Read/Write Control OE Output Enable Data Byte Control I/O1~I/O16 ...

Page 2

... I/O6 I/O7 I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O16 CE 1 CE2 LB UB R/W OE BYTE MEMORY CELL ARRAY 4,096 256 16 (16,777,216) SENSE AMP COLUMN ADDRESS DECODER COLUMN ADDRESS REGISTER COLUMN ADDRESS BUFFER CLOCK GENERATOR A TC55VBM416AFTN55 V DD GND CE A17 A7 2003-12-25 2/14 ...

Page 3

... High High High High High-Z RATING Ta PARAMETER V 2.3 V~2 2.7 V~3 TC55VBM416AFTN55 I/O9~I/O15 I/O16 High-Z A-1 Output Output Output Output High-Z High-Z High-Z A-1 Input Input Input Input High-Z High-Z High-Z A-1 High-Z High-Z High-Z High-Z High-Z High-Z High-Z High-Z High-Z ...

Page 4

... V (at BYTE 0 0.2 V) 0.2 V (at BYTE 0.2 V, CE2 V 0 (at BYTE V 0 MHz) TEST CONDITION V GND IN V GND OUT TC55VBM416AFTN55 MIN TYP 0.5 2 MIN t cycle 1 s MIN t cycle 40~85°C 0 25°C 0.9 3 40~40°C Ta 40~85°C MAX 10 10 ...

Page 5

... R/W High to Output Active OEW t Data Setup Time DS t Data Hold Time DH Note and t are specified in time when an output becomes high impedance, and are not judged depending on OD ODO BD ODW an output voltage level. PARAMETER PARAMETER TC55VBM416AFTN55 MIN MAX UNIT MIN MAX UNIT ...

Page 6

... R/W High to Output Active OEW t Data Setup Time DS t Data Hold Time DH Note and t are specified in time when an output becomes high impedance, and are not judged depending on OD ODO BD ODW an output voltage level. PARAMETER PARAMETER TC55VBM416AFTN55 MIN MAX UNIT MIN MAX UNIT ...

Page 7

... DD 90% 10% GND 1 V/ BYTE FUNCTION SYMBOL t BYTE Setup Time BS t BYTE Recovery Time BR TIMING DIAGRAMS BYTE CE2 CE 1 BYTE Fig.2 : Output load 90% 10 PARAMETER TC55VBM416AFTN55 TEST CONDITION 0 0 ns(Fig. TTL Gate(Fig. Dout R1 810 R2 1610 2 MIN MAX UNIT 5 ms ...

Page 8

... I/O1~16 (Word Mode) I/O1~8 (Byte Mode I/O1~16 (Word Mode) I/O1~8 (Byte Mode ACC t CO1 t CO2 OEE t COE (See Note ODW (See Note 2) (See Note 5) TC55VBM416AFTN55 ODO t BD VALID DATA OUT OEW Hi-Z (See Note VALID DATA IN (See Note 5) 2003-12-25 8/14 Hi-Z ...

Page 9

... A0~A19 (Word Mode) A-1~A19 (Byte Mode) R CE2 OUT I/O1~16 (Word Mode) I/O1~8 (Byte Mode I/O1~16 (Word Mode) I/O1~8 (Byte Mode) (See Note ODW Hi-Z t COE (See Note 5) (See Note ODW Hi-Z t COE (See Note 5) TC55VBM416AFTN55 VALID DATA Hi VALID DATA IN 2003-12-25 9/14 ...

Page 10

... HIGH during the write cycle, the outputs will remain at high impedance. (5) Because I/O signals may be in the output state at this time, input signals of reverse polarity must not be applied. (See Note 4) CONTROLLED ODW Hi-Z t COE (See Note 5) TC55VBM416AFTN55 VALID DATA IN 2003-12-25 10/14 ...

Page 11

... Note 1) DATA RETENTION MODE (See Note 2) t CDR V 0 (See Note 3) DATA RETENTION MODE t CDR 0.2 V (See Note 4) DATA RETENTION MODE (See Note 5) t CDR V 0 TC55VBM416AFTN55 ) MIN TYP MAX 1.5 3 (See Note (See Note 2003-12-25 11/14 UNIT ...

Page 12

... controlled data retention mode, minimum standby current mode is entered when CE1 0 CE1 V DD (5) When UB ( operating at the V the transition of V from 2.3(2.7) to 2.2V(2.4 V). DD (min.) level, the operating current is given 0.2 V, CE2 0 CE2 V DD (min.) level, the operating current is given TC55VBM416AFTN55 DDS1 0.2 V. DDS1 2003-12-25 12/14 during the during ...

Page 13

... PACKAGE DIMENSIONS TSOP Ⅰ 48-P-1220-0. Weight:0.51 g (typ) 18.4 0.1 20.0 0.2 TC55VBM416AFTN55 Unit: 1.0 0.1 0.1 0.05 1.2max 0.5 0.1 2003-12-25 13/14 ...

Page 14

... The products described in this document are subject to the foreign exchange and foreign trade laws. TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. TC55VBM416AFTN55 030619EBA 2003-12-25 14/14 ...

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