STK14CA8-NF25TR Cypress Semiconductor Corp, STK14CA8-NF25TR Datasheet - Page 4

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STK14CA8-NF25TR

Manufacturer Part Number
STK14CA8-NF25TR
Description
IC NVSRAM 1MBIT 25NS 32SOIC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of STK14CA8-NF25TR

Format - Memory
RAM
Memory Type
NVSRAM (Non-Volatile SRAM)
Memory Size
1M (128K x 8)
Speed
25ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
32-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Absolute Maximum Ratings
Voltage on Input Relative to Ground.................–0.5V to 4.1V
Voltage on Input Relative to V
Voltage on DQ
Temperature under Bias ............................... –55°C to 125°C
Junction Temperature ................................... –55°C to 140°C
Storage Temperature .................................... –65°C to 150°C
Power Dissipation............................................................. 1W
DC Output Current (1 output at a time, 1s duration).... 15 mA
DC Characteristics
(V
Note
Document Number: 001-51592 Rev. *A
I
I
I
I
I
I
I
V
V
V
V
T
V
V
NV
DATA
Symbol
CC 1
CC 2
CC 3
CC 4
SB
ILK
OLK
A
IH
IL
OH
OL
CC
CAP
CC
C
= 2.7V to 3.6V)
R
The HSB pin has I
Average V
Average V
STORE
Average V
200 ns
3V, 25°C, Typical
Average V
AutoStore Cycle
V
(Standby, Stable CMOS Levels)
Input Leakage Current
Off-State Output Leakage
Current
Input Logic “1” Voltage
Input Logic “0” Voltage
Output Logic “1” Voltage
Output Logic “0” Voltage
Operating Temperature
Operating Voltage
Storage Capacitance
Nonvolatile STORE operations
Data Retention
CC
Standby Current
0-7
or HSB ......................–0.5V to (V
Parameter
CC
CC
CC
CAP
Current at t
Current
Current during
Current during
OUT
SS
=-10 uA for V
...........–0.5V to (V
AVAV
=
V
OH
SS
Min
200
Commercial
2.0
2.4
2.7
17
20
0
of 2.4 V, this parameter is characterized but not tested.
–0.5
CC
CC
V
+ 0.5V)
+ 0.5V)
CC
Max
120
0.8
0.4
3.6
65
55
50
10
±1
±1
70
3
3
3
+0.3
V
SS
Min
–40
200
2.0
2.4
2.7
17
20
–0.5
Industrial
NF (SOP-32) PACKAGE THERMAL CHARACTERISTICS
θ
RF (SSOP-48) PACKAGE THERMAL CHARACTERISTICS
θ
Note: Stresses greater than those listed under
Maximum Ratings
This is a stress rating only, and functional operation of the device
at conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
reliability.
jc
jc
5.4 C/W; θ
6.2 C/W; θ
V
CC
Max
120
0.8
0.4
3.6
70
60
55
10
±1
±1
85
3
3
3
+0.3
ja
ja
Years At 55
Units
44.3 [0fpm], 37.9 [200fpm], 35.1 C/W [500fpm].
51.1 [0fpm], 44.7 [200fpm], 41.8 C/W [500fpm].
mA
mA
mA
mA
mA
mA
mA
μA
μA
°
μF
V
V
K
V
V
V
C
may cause permanent damage to the device.
t
t
t
Dependent on output loading and cycle
rate. Values obtained without output
loads.
All Inputs Don’t Care, V
Average current for duration of STORE
cycle (t
W
All Other Inputs Cycling at CMOS Levels
Dependent on output loading and cycle
rate. Values obtained without output
loads.
All Inputs Don’t Care
Average current for duration of STORE
cycle (t
E
All Others V
Standby current level after nonvolatile
cycle complete
V
V
V
V
All Inputs
All Inputs
I
I
3.3V + 0.3V
Between V
AVAV
AVAV
AVAV
OUT
OUT
CC
IN
CC
IN
≥ (
= V
= V
= max
= max
(V
= – 2 mA
= 4 mA
= 25 ns
= 35 ns
= 45 ns
V
°
C
CC
STORE
STORE
SS
SS
CC
-0.2V)
to V
– 0.2V)
to V
CAP
IN ≤
)
)
CC
CC
0.2V or
pin and V
, E or G
Notes
STK14CA8
CC
SS
(V
= max
, 5V rated.
CC
V
Page 4 of 17
IH
-0.2V)
Absolute
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