W25X64VZEIG Winbond Electronics, W25X64VZEIG Datasheet - Page 44

• Manufacturer Part Number: W25X64VZEIG
• Description: IC FLASH 64MBIT 75MHZ 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25X64VZEIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
SOLDER PATTERN
package.
placement of exposed PCB vias under the pad.
SYMBOL
M
N
Q
R
P
MIN
MILLIMETERS
T
3.40
4.30
6.00
0.50
0.75
YP.
W25X16, W25X16A, W25X32, W25X64
MAX
- 44 -
MIN
INCHES
0.13 8
0.16 2
0.23 0
0.01 6
0.02 5
TYP.
3
9
6
9
5
MAX