W25X10AVSNIG Winbond Electronics, W25X10AVSNIG Datasheet - Page 38

• Manufacturer Part Number: W25X10AVSNIG
• Description: IC FLASH 16MBIT 100MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X10AVSNIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 1M (128K x 8)
• Speed: 100MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

12.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
12. PACKAGE SPECIFICATION
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SEATING PLANE
Y
8

1
SYMBOL
D
E
e
Y
A1
H
A
b
L

c
(3)
(2)
(4)
(3)
E
b
W25X10A, W25X20A, W25X40A, W25X80A
D
e
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
Min
0°
-
4
5
MILLIMETERS
1.27 BSC
A1
- 38 -
A
E
H
E
Max
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
10°
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
0°
-
0.050 BSC
INCHES
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
10°
0.25
GAUGE PLANE
c
L
O