CY22E016L-SZ35XC Cypress Semiconductor Corp, CY22E016L-SZ35XC Datasheet - Page 13

• Manufacturer Part Number: CY22E016L-SZ35XC
• Description: IC NVSRAM 16KBIT 35NS 28SOIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY22E016L-SZ35XC

• Format - Memory: RAM
• Memory Type: NVSRAM (Non-Volatile SRAM)
• Memory Size: 16K (2K x 8)
• Speed: 35ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
All the parts below are Pb-Free.
Package Diagrams
Document Number: 001-06727 Rev. *E
Speed
0.050[1.27]
TYP.
(ns)
25
25
35
35
45
45
14
15
CY22E016L-SZ25XCT
CY22E016L-SZ25XC
CY22E016L-SZ25XIT
CY22E016L-SZ25XI
CY22E016L-SZ35XCT
CY22E016L-SZ35XC
CY22E016L-SZ35XIT
CY22E016L-SZ35XI
CY22E016L-SZ45XCT
CY22E016L-SZ45XC
CY22E016L-SZ45XIT
CY22E016L-SZ45XI
0.697[17.70]
0.713[18.11]
Ordering Code
0.013[0.33]
0.019[0.48]
28
1
0.291[7.39]
0.300[7.62]
0.004[0.10]
0.0118[0.30]
PIN 1 ID
28-Pin(300 Mil) Molded SOIC
0.026[0.66]
0.032[0.81]
0.092[2.33]
0.105[2.67]
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
51-85026
Package
Name
0.394[10.01]
0.419[10.64]
*
SEATING PLANE
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
28-pin SOIC
*
0.004[0.10]
Package Type
MIN.
MAX.
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.015[0.38]
0.050[1.27]
PART #
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Operating
Range
CY22E016L
0.0091[0.23]
0.0125[3.17]
51-85026-*D
Page 13 of 14
*
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