MT29F4G08BABWP Micron Technology Inc, MT29F4G08BABWP Datasheet - Page 20
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MT29F4G08BABWP
Manufacturer Part Number
MT29F4G08BABWP
Description
IC FLASH 4GBIT 48TSOP
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F2G08AAAWP.pdf
(57 pages)
Specifications of MT29F4G08BABWP
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
4G (512M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Other names
557-1152-2
Table 6:
PDF: 09005aef818a56a7 / Source: 09005aef81590bdd
2gb_nand_m29b__2.fm - Rev. I 1/06 EN
CLE
H
H
X
X
X
X
L
L
L
L
L
ALE
Mode Selection
H
H
X
X
X
X
L
L
L
L
L
Notes: 1. WP# should be biased to CMOS HIGH or LOW for standby.
CE#
X
X
X
H
L
L
L
L
L
L
L
2. PRE should be tied to V
3. Mode selection settings for this table: H = Logic level HIGH; L = Logic level LOW;
The PRE function is not supported on extended-temperature devices.
X = V
WE#
H
H
X
X
X
X
IH
or V
IL
RE#
.
H
H
H
H
H
H
X
X
X
X
2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory
0V/V
WP#
CC
X
X
H
H
H
X
X
H
H
L
CC
or ground. Do not transition PRE during device operations.
1
20
0V/V
PRE
X
X
X
X
X
X
X
X
X
X
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CC
2
Mode
Read mode
Write mode
Data input
Sequential read and data output
During read (busy)
During program (busy)
During erase (busy)
Write protect
Standby
©2004 Micron Technology, Inc. All rights reserved.
Command input
Address input
Command input
Address input
Bus Operation