AT24C512W-10SU-2.7 Atmel, AT24C512W-10SU-2.7 Datasheet - Page 13

• Manufacturer Part Number: AT24C512W-10SU-2.7
• Description: IC EEPROM 512KBIT 1MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT24C512W-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 512K (64K x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AT24C512W-10SU2.7

Ordering Information
Notes:
1116O–SEEPR–1/07
8CN1
8P3
8S2
8S1
8A2
8Y4
8U4-1
–2.7
–1.8
Ordering Code
AT24C512C1-10CU-2.7
AT24C512C1-10CU-1.8
AT24C512-10PU-2.7
AT24C512-10PU-1.8
AT24C512W-10SU-2.7
AT24C512W-10SU-1.8
AT24C512N-10SU-2.7
AT24C512N-10SU-1.8
AT24C512-10TU-2.7
AT24C512-10TU-1.8
AT24C512Y4-10YU-1.8
AT24C512U4-10UU-1.8
AT24C512-W1.8-11
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
tables.
contact Serial EEPROM marketing.
8-lead, 0.300" Wide, Leadless Array Package (LAP)
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
(3)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(1)
Package Type
Options
Die Sale
Package
8U4-1
8CN1
8CN1
8P3
8P3
8S2
8S2
8S1
8S1
8A2
8A2
8Y4
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
13