AT24C02N-10SU-2.7 Atmel, AT24C02N-10SU-2.7 Datasheet - Page 16

• Manufacturer Part Number: AT24C02N-10SU-2.7
• Description: IC EEPROM 2KBIT 400KHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT24C02N-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AT24C08A Ordering Information
Notes:
16
8P3
8S1
8A2
8Y1
8Y6
8U2-1
−2.7
−1.8
Ordering Code
AT24C08A-10PU-2.7
AT24C08A-10PU-1.8
AT24C08AN-10SU-2.7
AT24C08AN-10SU-1.8
AT24C08A-10TU-2.7
AT24C08A-10TU-1.8
AT24C08AY1-10YU-1.8
AT24C08AY6-10YH-1.8
AT24C08AU2-10UU-1.8
AT24C08A-W1.8-11
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
AT24C01A/02/04/08A/16A
contact Serial EEPROM Marketing.
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8-ball, die Ball Grid Array Package (dBGA2)
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
(4)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(3)
(2
(Not recommended for new design)
(1)
Package Type
Options
Package
Die Sale
8U2-1
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(−40°C to 85°C)
(–40°C to 85°C)
0180Z1–SEEPR–5/07