MAX3296CGILEVKIT Maxim Integrated, MAX3296CGILEVKIT Datasheet - Page 18

• Manufacturer Part Number: MAX3296CGILEVKIT
• Description: Power Management IC Development Tools
• Manufacturer: Maxim Integrated
• Series: MAX3286, MAX3287, MAX3288, MAX3289, MAX3296, MAX3297, MAX3298, MAX3299r

The modulator is not needed. Leave TC and MODSET
open. Connect IN+ to VCC, IN- to REF, and leave OUT+
and OUT– open.
The MAX3286/MAX3296 series uses bondpads with gold
metalization. Make connections to the die with gold wire
only, using ball-bonding techniques. Wedge bonding is
not recommended. Bondpad size is 4 mil square. Die
thickness is typically 15 mils (0.38mm).
3.0V to 5.5V, 1.25Gbps/2.5Gbps
LAN Laser Drivers
Figure 14. Logic Outputs
Figure 16. Modulator Outputs
18
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MAX3286
MAX3296
2.5k
4k
V
CC
0.2pF
PACKAGE
FAULT, FAULT, POR
1.5nH
Wirebonding Die
OUT-
1pF
V
CC
50
Figures 14–18 show typical input/output models for the
MAX3286/MAX3296 series of laser drivers. If dice are
used, replace the package parasitic elements with
bondwire parasitic elements.
Figure 15. SHDNDRV Output
V
CC
1pF
50
OUT+
MAX3286
MAX3296
1.5nH
PACKAGE
550
10k
V
0.2pF
CC
60
Interface Models
SHDNDRV