MAX5988BEVKIT# Maxim Integrated, MAX5988BEVKIT# Datasheet - Page 2

• Manufacturer Part Number: MAX5988BEVKIT#
• Description: Power Management IC Development Tools MAX5988B Eval Kit
• Manufacturer: Maxim Integrated

Specifications of MAX5988BEVKIT#

• Rohs: yes

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
C1 = 68nF, C2 = 10µF, C3 = 1µF (see
enced to GND, unless otherwise noted. T
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
Maxim Integrated
(All voltages referenced to GND, unless otherwise noted.)
V
V
AUX, LDO_IN, LED to GND .................................... -0.3V to 16V
LDO_OUT to GND .............................. -0.3V to (LDO_IN + 0.3V)
LDO_FB to GND ......................................................-0.3V to +6V
LX to GND ................................................ -0.3V to (V
LDO_OUT, VDRV, FB, RESET, WK, SL, ULP, MPS, CLASS2
Note 1: See
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IEEE 802.3af-Compliant, High-Efficiency, Class 1/Class 2,
DD
CC
POWER DEVICE (PD) INTERFACE
DETECTION MODE
Input Offset Current
Effective Differential Input
Resistance
CLASSIFICATION MODE
Classification Enable Threshold
Classification Disable Threshold
Classification Stability Time
Classification Current
POWER MODE
V DD Supply Voltage Range
V DD Supply Current
DD
to GND ..............................................................-0.3V to +6V
, WAD, RREF to GND ........................ -0.3V to (V
to GND ..........................-0.3V to +70V (internally clamped)
= 48V, R
Powered Devices with Integrated DC-DC Converter
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
Figure
SIG
= 24.9kω, LED, V
1, Test Circuit.
(100V, 100ms, R
CC
, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
Figure
V TH,CLS,DIS
V TH,CLS,EN
JC
TEST
A
SYMBOL
I OFFSET
I CLASS
) ..................2.7°C/W
= T
JA
V DD
I DD
dR
) ..............35°C/W
3), V
= 3.3kω) (Note 1)
J
= -40°C to +85°C, unless otherwise noted. Typical values are at T
FB
DD
CC
= V
+ 0.3V)
+ 0.3V)
AUX
V VDD = 1.4V to 10.1V (Note 4)
V VDD = 1.4V to 10.1V with 1V step,
(Note 5)
V DD rising
V DD rising
V DD = 12.6V
to 20V
V DD = 60V
= 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
CONDITIONS
VDRV to V
PGND to GND ......................................................-0.3V to +0.3V
LX Total RMS Current ...........................................................1.6A
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN (derate 28.6mW/NC above +70NC) ..............2285.7mW
CLASS2 = GND
CLASS2 = VDRV
MAX5988A/MAX5988B
DD
............................................ -0.3V to (V
23.95
10.2
9.12
16.1
MIN
22
A
= + 70NC)
11.42
TYP
10.5
3.3
23
18
2
A
= +25°C.) (Note 3)
11.88
MAX
25.5
12.5
23.8
20.9
4.5
60
8
DD
+ 0.3V)
UNITS
mA
mA
ms
µA
kω
V
V
V
2