MAX5988AEVKIT# Maxim Integrated, MAX5988AEVKIT# Datasheet - Page 16

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MAX5988AEVKIT#

Manufacturer Part Number
MAX5988AEVKIT#
Description
Power Management IC Development Tools MAX5988A Eval Kit
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX5988AEVKIT#

Rohs
yes
Careful PCB layout is critical to achieve clean and stable
operation. It is highly recommended to duplicate the
MAX5988A EV kit layout for optimum performance. If
deviation is necessary, follow these guidelines for good
PCB layout:
Maxim Integrated
1) Connect input and output capacitors to the power
2) Place capacitors on V
3) Keep the high-current paths as short and wide as
IEEE 802.3af-Compliant, High-Efficiency, Class 1/Class 2,
ground plane; connect all other capacitors to the sig-
nal ground plane.
as possible to the IC and its corresponding pin using
direct traces. Keep power ground plane (connected
to PGND) and signal ground plane (connected to
GND) separate.
possible. Keep the path of switching current short
Powered Devices with Integrated DC-DC Converter
DD
, V
CC
, AUX, VDRV as close
PCB Layout
4) Connect V
5) Ensure all feedback connections are short and direct.
6) Route high-speed switching nodes, such as LX, away
7) Place enough vias in the pad for the EP of the devices
and minimize the loop area formed by LX, the output
capacitors, and the input capacitors.
copper area to help cool the IC to further improve
efficiency and long-term reliability.
Place the feedback resistors and compensation com-
ponents as close as possible to the IC.
from sensitive analog areas (FB).
so that heat generated inside can be effectively dis-
sipated by the PCB copper. The recommended spac-
ing for the vias is 1mm to 1.2mm pitch. The thermal
vias should be plated (1oz copper) and have a small
barrel diameter (0.3mm to 0.33mm).
MAX5988A/MAX5988B
DD
, V
CC
, and PGND separately to a large
16

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