NCP380HMU10AGEVB ON Semiconductor, NCP380HMU10AGEVB Datasheet - Page 21

• Manufacturer Part Number: NCP380HMU10AGEVB
• Description: Power Management IC Development Tools NCP380 EVAL BOARD
• Manufacturer: ON Semiconductor
• Type: Power Driversr

Specifications of NCP380HMU10AGEVB

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: NCP380
• Output Current: 10 A

6X
NOTE 4
REFERENCE
0.10 C
0.08 C
PIN ONE
0.10 C
DETAIL A
0.10 C
e
Í Í Í
Í Í Í
Í Í Í
DETAIL B
BOTTOM VIEW
6
1
TOP VIEW
SIDE VIEW
D2
D
4
3
A1
A3
6X
E2
A B
L
b
0.10
0.05
E
A
M
M
C
C
C
SEATING
PLANE
L1
PACKAGE DIMENSIONS
A
EXPOSED Cu
B
NOTE 5
UDFN6 2x2, 0.65P
ALTERNATE TERMINAL
http://onsemi.com
CONSTRUCTIONS
É É É
Ç Ç Ç
Ç Ç Ç
CASE 517AB
DETAIL A
ISSUE C
END VIEW
L
21
CONSTRUCTIONS
MOLD CMPD
DETAIL B
ALTERNATE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
L
É É Ç Ç
PACKAGE
OUTLINE
PITCH
NOTES:
0.95
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE
5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE CONNECTED
0.65
SOLDERING FOOTPRINT*
BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP.
TERMINALS.
TO THE THERMAL PAD.
A3
1
RECOMMENDED
1.70
DIM
DIMENSIONS: MILLIMETERS
A1
A3
D2
E2
L1
A
D
E
b
e
L
MILLIMETERS
0.45
0.00
0.25
1.50
0.80
0.25
MIN
---
0.127 REF
2.00 BSC
0.65 BSC
2.00 BSC
MAX
0.55
0.05
0.35
1.70
1.00
0.35
0.15
0.40
6X
0.47
6X
2.30