MAX17595EVKIT# Maxim Integrated, MAX17595EVKIT# Datasheet - Page 2

• Manufacturer Part Number: MAX17595EVKIT#
• Description: Power Management IC Development Tools MAX17595 Eval Kit
• Manufacturer: Maxim Integrated

Specifications of MAX17595EVKIT#

• Rohs: yes

ABSOLUTE MAXIMUM RATINGS
V
V
V
NDRV to SGND .................................... -0.3V to +(V
EN/UVLO to SGND .................................. -0.3V to +(V
OVI, RT, DITHER, COMP, SS, FB,
CS to SGND ............................................................-0.8V to +6V
PGND to SGND ....................................................-0.3V to +0.3V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Junction-to-Ambient Thermal Resistance (q
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
V
otherwise noted. Typical values are at T
Maxim Integrated
INPUT SUPPLY (V
V
V
Wakeup
V
Shutdown Level
V
(Under UVLO)
V
Current
V
V
ENABLE (EN)
EN Undervoltage
Threshold
EN Input Leakage Current
IN
DRV
DRV
EN/UVLO
IN
SLOPE to SGND .................................................... -0.3V to +6V
IN
IN
IN
IN
IN
IN
IN
to SGND ..........................................................-0.3V to +40V
= 12V (for the MAX17595, bring V
Voltage Range
Bootstrap UVLO
Bootstrap UVLO
Supply Startup Current
Supply Shutdown
Supply Current
Clamp Voltage
to SGND ..................................-0.3V to +16V (MAX17595)
to SGND ..........-0.3V to +6V (MAX17596 and MAX17597)
PARAMETER
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
= +2V; NDRV, SS, COMP are unconnected, R
IN
)
SYMBOL
STARTUP
V
V
I
I
IN-UVR
V
IN-UVF
IN-SW
V
IN-SH
V
I
V
VIN-
I
ENR
ENF
INC
EN
IN
IN
A
= T
up to 21V for startup), V
JA
Peak-Current-Mode Controllers for
MAX17595
MAX17596/MAX17597
V
V
V
V
Switching, f
MAX17595, I
3)
V
V
V
J
) ..............48°C/W
IN
IN
IN
EN
EN
EN
EN
MAX17595/MAX17596/MAX17597
= +25NC.) (Note 2)
rising
falling
< UVLO
= 0V
rising
falling
= 1.5V, T
DRV
IN
Flyback and Boost Regulators
#
$
#
+ 0.3)V
+ 0.3)V
$
SW
RT
VIN
A
= 400kHz
= 25kI, C
= +25NC
= 2mA sinking, V
MAX17595
MAX17596/MAX17597
MAX17595
MAX17596/MAX17597
CONDITIONS
CS
Maximum Input/Output Current (Continuous)
V
NDRV (pulsed, for less than 100ns) .......................... 1.5A/-0.9A
Continuous Power Dissipation TQFN (single-layer board)
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Junction-to-Case Thermal Resistance (q
= V
IN
VIN
(derate 20.8mW/NC above +70NC) ............................1666mW
, V
SLOPE
= 1FF, C
DRV
EN
..........................................................................100mA
= V
= 0V (Note
VDRV
DITHER
= 1FF, T
= V
FB
18.5
1.16
-100
MIN
A
4.5
3.8
6.5
3.6
1.1
30
= V
8
= T
OVI
J
= -40NC to +125NC, unless
= V
TYP
1.21
1.15
4.1
3.9
20
20
20
33
7
2
JC
SGND
) .....................7°C/W
+100
MAX
21.5
1.26
4.4
7.5
4.2
1.2
29
36
32
32
36
= V
PGND
UNITS
mA
FA
FA
nA
= 0V,
V
V
V
V
V
2