LCMXO2-7000HE-B-EVN Lattice, LCMXO2-7000HE-B-EVN Datasheet - Page 15
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LCMXO2-7000HE-B-EVN
Manufacturer Part Number
LCMXO2-7000HE-B-EVN
Description
Programmable Logic IC Development Tools MachXO2-7000HE Breakout Board
Manufacturer
Lattice
Type
FPGAr
Datasheet
1.LCMXO2-7000HE-B-EVN.pdf
(23 pages)
Specifications of LCMXO2-7000HE-B-EVN
Product
Evaluation Kits
Tool Is For Evaluation Of
MachXO2-7000HE
Interface Type
I2C, SPI, USB
Operating Supply Voltage
1.2 V, 3.3 V
Dimensions
3 in x 3 in x 0.5 in
Maximum Operating Temperature
+ 90 C
Minimum Operating Temperature
0 C
For Use With
MachXO2-7000HE
MachXO2 Breakout Board
Evaluation Kit User’s Guide
Board Modifications
This section describes modifications to the board to change or add functionality.
Bypassing the USB Programming Interface
The USB programming interface circuit
(USB Programming and Debug Interface
section) may be optionally
bypassed by removing the 0 ohm resistors: R5, R6, R7, R8 (See
Appendix A.
Schematics, Sheet 2 of 5). Header
landing J1 provides JTAG signal access for jumper wires or a 1x8 pin header.
Applying External Power
The Breakout Board is powered by the circuit of Schematic Sheet 5 of 5 based on the 5V USB power source. You
may disconnect this power source by removing the 0 ohm resistors: R42 (VCC_1.2V) and R44 (VCC_3.3V). Power
connections are available from the expansion header landings, J3 (+1.2V, pins 1 and 3, schematic sheet 3 of 5) and
J4 (+3.3V, pins 1 and 3, schematic sheet 4 of 5).
Measuring Bank and Core Power
In addition to the expansion headers, test points (TP1, TP2) provide access to power supplies of the MachXO2
FPGA. Inline 1 ohm resistors: R24 (VCCIO0, +3.3V, Bank 0), R25 (VCCIO1, +3.3V, Bank 1), R26 (VCCIO2, +3.3V,
Bank 2), R27 (VCCIO3, +3.3V, Bank 3), R56 (VCC core, +1.2V) can be used to measure current for the power sup-
plies.
Mechanical Specifications
Dimensions: 3 in. [L] x 3 in. [W] x 1/2 in. [H]
Environmental Requirements
The evaluation board must be stored between -40° C and 100° C. The recommended operating temperature is
between 0° C and 90° C.
The board can be damaged without proper anti-static handling.
Glossary
FPGA: Field Programmable Gate Array
DIP: Dual in-line package
LED: Light Emitting Diode.
LUT: Look Up Table
PCB: Printed Circuit Board
RoHS: Restriction of Hazardous Substances Directive
USB: Universal Serial Bus
WDT: Watchdog Timer
Troubleshooting
Use the tips in this section to diagnose problems with the Breakout Board.
LEDs Do Not Flash
If power is applied but the board does not flash according to the preprogrammed counter demonstration then it is
likely the board has been reprogrammed with a new design. Follow the directions in the
Demonstration Design
sec-
tion to restore the factory default.
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