IS61C6416AL-12TLI-TR ISSI, Integrated Silicon Solution Inc, IS61C6416AL-12TLI-TR Datasheet - Page 15

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IS61C6416AL-12TLI-TR

Manufacturer Part Number
IS61C6416AL-12TLI-TR
Description
IC SRAM 1MBIT 12NS 44TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61C6416AL-12TLI-TR

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
1M (64K x 16)
Speed
12ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TSOP II
Density
1Mb
Access Time (max)
12ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
16b
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
45mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Word Size
16b
Number Of Words
64K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS61C6416AL-12TLI-TR
Manufacturer:
ISSI
Quantity:
1 000
400-mil Plastic SOJ
Package Code: K
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
10/29/03
No. Leads (N)
Symbol
A1
A2
E1
E2
N
A
B
C
D
E
b
e
1
Min
Millimeters
18.29 18.54
11.05 11.30
10.03 10.29
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
e
Max
3.75
0.51
0.81
0.33
28
D
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.720 0.730
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
Max
B
N/2
N/2+1
b
20.82 21.08
10.03 10.29
11.05 11.30
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
A
E1
A1
Max
1-800-379-4774
3.75
0.51
0.81
0.33
32
E
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.820 0.830
0.435 0.445
0.395 0.405
Inches
0.370 BSC
0.050 BSC
SEATING PLANE
Max
23.37 23.62
11.05 11.30
10.03 10.29
Min
Millimeters
3.25
0.64
2.08
0.38
0.66
0.18
1.27 BSC
9.40 BSC
E2
Notes:
1. Controlling dimension:
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Reference document: JEDEC
MS-027.
millimeters.
between centers.
the bottom of the package.
and should be measured from
include mold flash protrusions
Max
3.75
0.51
0.81
0.33
ISSI
36
Min
0.128 0.148
0.025
0.082
0.015 0.020
0.026 0.032
0.007 0.013
0.920 0.930
0.435 0.445
0.395 0.405
0.370 BSC
0.050 BSC
Inches
C
Max
A2
®

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