BU94603_EVK ROHM Semiconductor, BU94603_EVK Datasheet - Page 2

• Manufacturer Part Number: BU94603_EVK
• Description: Audio IC Development Tools MP3/WMA/AAC Media Decoder Eval Kit
• Manufacturer: ROHM Semiconductor
• Type: Audio Decodersr

Specifications of BU94603_EVK

• Rohs: yes
• Product: Evaluation Kits
• Tool Is For Evaluation Of: BU94601KV, BU94603KV, BU94604BKV
• Operating Supply Voltage: 3.3 V
• Description/function: Evaluation Kit
• Interface Type: I2C, USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 65 mA
• For Use With: BU94601KV, BU94603KV, BU94604BKV

USB/SD Host Audio Media Decoder Evaluation Board Manual
BU94603
25 February, 2013 – Revision A1
Table of Contents
Revision History ............................................................................................................................................ 2
Outline .......................................................................................................................................................... 3
Hardware ...................................................................................................................................................... 3
Software* ...................................................................................................................................................... 3
BU94603 Mode 1 “Stand Alone Mode” Setup Guide ................................................................................... 4
BU94603 Mode 1 Pushbutton Explanation/Operation Guide ...................................................................... 7
BU94603 Mode 2 “Slave Device Mode” Setup Guide ................................................................................... 8
BU94603 Mode 2 “UHAP.exe” Explanation/Operation Guide ................................................................... 12
Appendix A. Connecting to the “USB-to-I2C Cypress Controller Board” .................................................... 16
Appendix B. “UHAP.exe” GUI functions to I2C register command map ..................................................... 17
Appendix C. BU94603 Build of Materials (BoM) ......................................................................................... 20
Appendix D. BU94603 Eval board Schematic Overview ............................................................................. 23
Revision History
Version
A1.1
A0
A1
Description
Updated document to USDC format and for new
USDC board build
Appendix C/D added
Software download at distributor
2
01/31/2013
2/25/2013
4/16/2013
Date
Initials
KB/JC
JC
JC