CM1218-F4SE ON Semiconductor, CM1218-F4SE Datasheet - Page 6

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CM1218-F4SE

Manufacturer Part Number
CM1218-F4SE
Description
TVS Diode Arrays 4-ch ESD Protection 7pF capacitance
Manufacturer
ON Semiconductor
Series
CM1218r
Datasheet

Specifications of CM1218-F4SE

Product Category
TVS Diode Arrays
Rohs
yes
Polarity
Bidirectional
Channels
4 Channels
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Factory Pack Quantity
5000
0.05
A1
3X
E1
b
e
1
D
3
2
e
A
*For additional information on our Pb−Free strategy and soldering
C
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
E
SEATING
PLANE
SOT−23 3−Lead (TO−236AA)
DETAIL Z
PACKAGE DIMENSIONS
c
SOLDERING FOOTPRINT*
2.74
L
http://onsemi.com
RECOMMENDED
CASE 419AH−01
DETAIL Z
ISSUE O
DIMENSIONS: MILLIMETERS
M
6
GAUGE
PLANE
0.56
C
3X
L2
SEATING
PLANE
0.95
PITCH
0.82
3X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
5. PIN ONE INDICATOR MUST BE LOCATED IN THE IN-
Y14.5M, 1994.
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
DICATED ZONE.
DIM
A1
E1
L2
M
A
D
E
b
c
e
L
MILLIMETERS
0.75
0.05
0.30
0.08
2.80
2.10
1.20
0.40
MIN
0
0.95 BSC
0.25 BSC
°
MAX
1.17
0.15
0.50
0.20
3.05
2.64
1.40
0.60
8
°

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