24AA024-I/P Microchip Technology, 24AA024-I/P Datasheet
24AA024-I/P
Specifications of 24AA024-I/P
Related parts for 24AA024-I/P
24AA024-I/P Summary of contents
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... I No The device has a page write capability for bytes of data. Functional address lines allow the connection eight 24AA024/24LC024/ 24AA025/24LC025 devices on the same bus for up to 16K bits of contiguous EEPROM memory. The device is available in the standard 8-pin PDIP, 8-pin SOIC (3.90 mm), TSSOP, 2x3 DFN and MSOP packages. ...
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... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...
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... TABLE 1-2: AC CHARACTERISTICS All parameters apply across the specified operating ranges unless otherwise noted. Parameter Symbol Clock frequency F CLK Clock high time T HIGH Clock low time T LOW SDA and SCL rise time T R SDA and SCL fall time T F Start condition hold time ...
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... FIGURE 1-1: BUS TIMING DATA T F SCL STA T LOW SDA STA SDA OUT DS21210K-page 4 T HIGH DAT SU DAT STO T BUF © 2007 Microchip Technology Inc. ...
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... The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24AA024/ 24LC024/24AA025/24LC025 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated ...
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... The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: The 24AA024/24LC024/24AA025/24LC025 does not generate any Acknowledge bits if an internal programming cycle is in progress. The device that acknowledges has to pull down the SDA ...
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... The last bit of the control byte defines the operation to be performed. When set to a one, a read operation is selected. When set to a zero, a write operation is selected. Following the Start condition, the 24AA024/ 24LC024/24AA025/24LC025 monitors the SDA bus checking the control byte being transmitted. Upon receiving a ‘ ...
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... The device will acknowledge this control byte during the ninth clock pulse. The next byte transmitted by the master is the word address and will be written into the Address Pointer of the 24AA024/ 24LC024/24AA025/24LC025. After receiving another Acknowledge signal from the 24AA024/24LC024/ ...
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... ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle, with ACK polling being initiated immediately ...
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... Therefore, if the previous read access was to address n, the next current address read operation would access data from address Upon receipt of the slave address with the R/W bit set to ‘1’, the 24AA024/ 24LC024/24AA025/24LC025 issues an acknowledge and transmits the 8-bit data word. The master will not ...
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... FIGURE 8-2: RANDOM READ S T BUS ACTIVITY Control A MASTER SDA LINE BUS ACTIVITY FIGURE 8-3: SEQUENTIAL READ BUS ACTIVITY Control MASTER Byte SDA LINE A C BUS ACTIVITY K © 2007 Microchip Technology Inc Word Control A Byte Address (n) Byte Data (n) Data ( Data ( ...
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... PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead MSOP XXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN DS21210K-page 12 Example: 24LC024 e I/P 13F 3 0519 ...
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... Line Marking Codes Part Number TSSOP 24AA024 4A24 24LC024 4L24 24AA025 4A25 24LC025 4L25 Note Temperature grade (I, E) Legend: XX...X Part number or part number code T Temperature ( Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) ...
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... Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width ...
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... Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width ...
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... Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width ...
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... Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width ...
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... Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length ...
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... APPENDIX A: REVISION HISTORY Revision F Corrections to Section 1.0, Electrical Characteristics. Revision G Added part number 24AA025 to document. Correction to Section 1.0, Ambient Temperature. Revision H Added DFN package. Revision J (02/2007) Revised Features section; Revised Pin Function Table; Changed 1.8V to 1.7V, Table 1-1 and Table 1-2; ...
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... NOTES: DS21210K-page 20 © 2007 Microchip Technology Inc. ...
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... THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’ ...
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... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA024/24LC024/24AA025/24LC025 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...
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... Plastic DIP, (300 mil Body), 8-lead SN = Plastic SOIC, (3.90 mm Body TSSOP, 8-lead MS = MSOP, 8-lead MC = 2x3 DFN, 8-lead © 2007 Microchip Technology Inc. . Examples: a) 24AA024-I/P: Industrial Temperature, 1.7V, PDIP Package b) 24AA024-I/SN: Industrial Temperature, 1.7V, SOIC Package c) 24AA025T-I/ST: Industrial Temperature, 1.7V, TSSOP Package, Tape and Reel 24LC024-I/P: ...
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... NOTES: DS21210K-page 24 © 2007 Microchip Technology Inc. ...
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... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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