CY7C1355C-133AXC Cypress Semiconductor Corp, CY7C1355C-133AXC Datasheet - Page 17

IC SRAM 9MBIT 133MHZ 100LQFP

CY7C1355C-133AXC

Manufacturer Part Number
CY7C1355C-133AXC
Description
IC SRAM 9MBIT 133MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet

Specifications of CY7C1355C-133AXC

Memory Size
9M (256K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
6.5 ns
Maximum Clock Frequency
133 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
250 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Memory Configuration
512K X 18 / 256K X 36
Clock Frequency
133MHz
Supply Voltage Range
3.135V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-1862
CY7C1355C-133AXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1355C-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1355C-133AXC
Manufacturer:
CYP
Quantity:
618
Part Number:
CY7C1355C-133AXC
0
Part Number:
CY7C1355C-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Scan Register Sizes
Identification Codes
Document Number: 38-05539 Rev. *H
Instruction
Bypass
ID
Boundary scan order (119-ball BGA package)
Boundary scan order (165-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Instruction
Register Name
Code
000
001
010
011
100
101
110
111
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to high Z state. This instruction is not 1149.1 compliant.
Loads the ID register with the vendor ID code and places the register between TDI and
TDO. This operation does not affect SRAM operations.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a high Z state.
Do Not Use: This instruction is reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation. This instruction does not implement 1149.1 preload function
and is therefore not 1149.1 compliant.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Bit Size (× 36)
32
69
69
3
1
Description
CY7C1355C, CY7C1357C
Bit Size (× 18)
32
69
69
3
1
Page 17 of 32
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