SP3012-06UTG Littelfuse, SP3012-06UTG Datasheet

SP3012-06UTG

Manufacturer Part Number

SP3012-06UTG

Description

TVS Diode Arrays 6 Ch 12KV 0.5pF

Manufacturer

Littelfuse

Series

SP3012r

Datasheet

1.SP3012-06UTG.pdf (6 pages)

Specifications of SP3012-06UTG

Product Category

TVS Diode Arrays

Rohs

yes

Channels

6 Channels

Clamping Voltage

7 V

Operating Voltage

6 V

Peak Surge Current

4 A

Termination Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Maximum Operating Temperature

+ 125 C

Capacitance

0.5 pF

Dimensions

1.35 mm W x 3.5 mm L x 0.5 mm H

Package / Case

uDFN

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

SP3012-06UTG

Manufacturer:

LITTLEFUSE

Quantity:

30 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

SP3012-06UTG

Manufacturer:

LITTEFUSE

Quantity:

20 000

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Specifications are subject to change without notice.

Please refer to

TVS Diode Arrays

SP3012 Series 0.5pF Diode Array for USB3.0

Low Capacitance ESD Protection - SP3012 Series

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving

applications unless otherwise expressly indicated.

Functional Block Diagram

Pinout

*Pins 6, 7 , 9, 10 are not internally connected but should be connected to the trace.

*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the

opposite pin with the PCB trace.

www.littelfuse.com

Pin 1

Pin 2

Pin 4

Pin 5

SP3012-04UTG

SP3012-06UTG

for current information.

(SPA

SP3012-04UTG

GND (Pins 3,8)

SP3012-06UTG

Devices)

Revision: September 20, 2012

USB Port

SSTX+

SSTX-

SSRX+

SSRX-

Description

The SP3012 integrates either 4 or 6 channels of ultra

low capacitance rail-to-rail diodes and an additional zener

diode to provide protection for electronic equipment

that may experience destructive electrostatic discharges

(ESD). These robust devices can safely absorb repetitive

ESD strikes above the maximum level specified in the

IEC61000-4-2 international standard (±8kV contact

discharge) without performance degradation. The

extremely low loading capacitance also makes it ideal for

protecting high speed signal lines such as USB3.0, HDMI,

USB2.0, and eSATA.

Features

Applications

Application Example for USB3.0

• ESD, IEC61000-4-2,

• EFT, IEC61000-4-4, 40A

• Lightning, IEC61000-4-5,

• Low capacitance of 0.5pF

• LCD/PDP TVs

• External Storages

• DVD/Blu-ray Players

• Desktops

• MP3/PMP

GND

D+

D-

±12kV contact, ±25kV air

4A (t

(TYP) per I/O

BUS

=5/50ns)

=8/20μs)

SP3012-06UTG

• Set Top Boxes

• Smartphones

• Ultrabooks/Notebooks

• Digital Cameras

• Low leakage current of

• S mall form factor

Signal GND

1.5μA (MAX) at 5V

μDFN (JEDEC MO-

229) package provides

flow through routing to

simplify PCB layout

RoHS

USB Controller

SP3012 Series

GREEN

Related parts for SP3012-06UTG

SP3012-06UTG Summary of contents

Page 1

... SSRX- GND Revision: September 20, 2012 RoHS Pb GREEN • Low leakage current of 1.5μA (MAX • S mall form factor μDFN (JEDEC MO- 229) package provides flow through routing to simplify PCB layout • Set Top Boxes • Smartphones • Ultrabooks/Notebooks • Digital Cameras USB Controller IC SP3012-06UTG Signal GND SP3012 Series ...

Page 2

... TVS Diode Arrays Low Capacitance ESD Protection - SP3012 Series Absolute Maximum Ratings Symbol Parameter I Peak Current (t =8/20μ Operating Temperature OP T Storage Temperature STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied ...

Page 3

... Ordering Information 20 – 40 seconds 6°C/second max Part Number 8 minutes Max. SP3012-04UTG 260°C SP3012-06UTG Part Numbering System SP 3012 Silicon Protection Array (SPA ) TM Family of TVS Diode Arrays Series Number of Channels channel channel ...

Page 4

... USB 2.0 lines (D+/D-) that run at the slower speed of 480Mbps and therefore are not as critical as the 5Gbps Super-Speed traces. SP3012 Series (SPA Devices) ® Figure 1: PCB Layout of the SP3012-06UTG for USB 3.0 Figure 2 shows the USB 3.0 eye diagram that resulted from the PCB layout above with the SP3012-06UTG soldered on the landing pattern. 500 0 Wfrms:500 -500 Base: 27 ...

Page 5

... TVS Diode Arrays (SPA Devices) ® Low Capacitance ESD Protection - SP3012 Series Package Dimensions— µDFN-10 (2.5x1.0x0.5mm) Top View Side View 0. Seating Plane 0. 0. Bottom View R0.125 L 2xR0.075mm (7x) e Recomended Soldering Pad Layout P1 P Embossed Carrier Tape & Reel Specification— µDFN-10 ...

Page 6

... TVS Diode Arrays Low Capacitance ESD Protection - SP3012 Series Package Dimensions — µDFN-14 (3.5x1.35x0.5mm) Top View PIN 1 Index Area Side View A1 A Seating Plane b C Bottom View Pin 1 Identiﬁcation Chamfer 0.10X45º Recomended Soldering Pad Layout Embossed Carrier Tape & Reel Specification — µDFN-14 ...

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