STM8L152M8T3 STMicroelectronics, STM8L152M8T3 Datasheet - Page 125
STM8L152M8T3
Manufacturer Part Number
STM8L152M8T3
Description
8-bit Microcontrollers - MCU 8-bit Ultralow MCU LCD 80pin 64kb Flash
Manufacturer
STMicroelectronics
Datasheet
1.STM8L152M8T7.pdf
(129 pages)
Specifications of STM8L152M8T3
Product Category
8-bit Microcontrollers - MCU
Rohs
yes
Core
STM8
Data Bus Width
8 bit
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STM8L15xx8, STM8L15xR6
Table 66.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 52. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
Symbol
back-side pad to PCB ground.
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
outline
0.550
0.020
0.530
0.150
0.230
7.000
4.700
7.000
4.700
0.500
0.400
Typ
(1)(2)(3)
millimeters
0.500
0.500
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.140
0.080
Min
0
Doc ID 17943 Rev 5
0.600
0.050
0.550
0.160
0.300
7.150
5.250
7.150
5.250
0.550
0.500
Max
Figure 53. Recommended footprint
0.02170
0.0008
0.0209
0.0059
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
7.30
Typ
0.30
0.55
0.20
12
1
48
13
(dimensions in mm)
inches
6.20
0.01970
0.0197
0.0055
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
0.0031
Package characteristics
Min
0
7.30
5.60
5.80
6.20
(1)
5.60
0.50
37
24
0.0236
0.0020
0.0217
0.0063
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
Max
36
25
(1)
0.75
125/129
5.80
ai15697
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