STM8L152C6U3 STMicroelectronics, STM8L152C6U3 Datasheet - Page 118

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STM8L152C6U3

Manufacturer Part Number
STM8L152C6U3
Description
8-bit Microcontrollers - MCU Ultra-Lo-pwr 8-bit MCU 32Kb
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM8L152C6U3

Rohs
yes

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Package characteristics
10.2.4
118/129
32-lead ultra thin fine pitch quad flat no-lead 5x5 mm package
(UFQFPN32)
Figure 49. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
4. Dimensions are in millimeters.
solder this back-side pad to PCB ground.
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
b
8
1
32
9
Doc ID 15962 Rev 12
e
Bottom view
D2
D
16
L
17
24
L
A1
E
STM8L151xx, STM8L152xx
A
ddd C
A0B8_ME

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