MT46H32M16LFBF-5:B TR Micron Technology Inc, MT46H32M16LFBF-5:B TR Datasheet - Page 5
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MT46H32M16LFBF-5:B TR
Manufacturer Part Number
MT46H32M16LFBF-5:B TR
Description
IC DDR SDRAM 512MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H32M16LFBF-5:B TR
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
512M (32Mx16)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
60-VFBGA
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
6.5/5ns
Maximum Clock Rate
200MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
115mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1382-2
Table 2:
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Bond Pad Order Comparison
Notes:
1. Blue cells indicate bond pad order differences.
For high-speed applications that use the single-sided configuration, special bonding
recommendations are provided in the part-specific die data sheet.
95nm, Double-Sided x16
BOND_OPT
High-Z
CAS#
RAS#
WE#
V
V
V
CKE
V
BA1
BA0
A10
A11
A12
V
V
V
CS#
V
V
V
V
V
V
V
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
BOND_OPT
High-Z
V
V
DQ15
DQ14
V
DQ13
DQ12
DQ11
DQ10
V
UDQS
V
V
LDQS
V
V
V
V
UDM
V
V
LDM
TEST
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
V
V
V
CK#
V
CK#
V
V
V
V
V
V
V
V
V
V
V
TQ
DD
DD
DD
DD
CK
CK
DD
DD
SS
SS
SS
SS
SS
SS
DD
DD
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
1
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
5
78nm, Double-Sided x16
BOND_OPT
A10/AP
High-Z
CAS#
RAS#
TEST
WE#
V
V
A11
A12
V
CKE
BA1
BA0
V
V
CS#
V
V
V
V
V
A4
A5
A6
A7
A8
A9
A0
A1
A2
A3
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
Micron Technology, Inc., reserves the right to change products or specifications without notice.
UDQS
V
V
V
DQ15
DQ14
DQ13
DQ12
V
DQ11
DQ10
V
LDQS
V
V
V
V
V
UDM
V
V
V
V
V
LDM
V
V
V
V
V
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
V
V
CK#
V
V
V
V
V
V
TQ
DD
DD
DD
DD
DD
CK
DD
DD
DD
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
Die Bond Pad Order Changes
DD
DD
DD
DD
SS
SS
SS
SS
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
©2007 Micron Technology, Inc. All rights reserved.