AT24C1024B-PU Atmel, AT24C1024B-PU Datasheet - Page 13
![IC EEPROM 1MBIT 1MHZ 8DIP](/photos/6/50/65033/313-8-dip_sml.jpg)
AT24C1024B-PU
Manufacturer Part Number
AT24C1024B-PU
Description
IC EEPROM 1MBIT 1MHZ 8DIP
Manufacturer
Atmel
Datasheet
1.AT24C1024BN-SH25-B.pdf
(25 pages)
Specifications of AT24C1024B-PU
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
1M (128K x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Organization
128 K x 8
Interface Type
2-Wire
Maximum Clock Frequency
400 KHz
Access Time
900 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.8 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
2.5 V, 3.3 V
Memory Configuration
131072 X 8
Clock Frequency
1MHz
Supply Voltage Range
1.8V To 5.5V
Memory Case Style
DIP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT24C1024B-PU2.5
Manufacturer:
ATMEL
Quantity:
1 500
Company:
Part Number:
AT24C1024B-PU25
Manufacturer:
ATMEL
Quantity:
1 011
Ordering Information
Notes:
5194F–SEEPR–1/08
8P3
8S1
8S2
8A2
8Y7
8U4-1
–1.8
–2.5
Ordering Code
AT24C1024B-PU (Bulk form only)
AT24C1024B-PU25 (Bulk form only)
AT24C1024BN-SH-B
AT24C1024BN-SH-T
AT24C1024BN-SH25-B
AT24C1024BN-SH25-T
AT24C1024BW-SH-B
AT24C1024BW-SH-T
AT24C1024BW-SH25-B
AT24C1024BW-SH25-T
AT24C1024B-TH-B
AT24C1024B-TH-T
AT24C1024B-TH25-B
AT24C1024B-TH25-T
AT24C1024BY7-YH-T
AT24C1024BY7-YH25-T
AT24C1024BU4-UU-T
AT24C1024B-W-11
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 3.6V)
Low-voltage (2.5V to 5.5V)
(2)
(3)
(1)
(2)
(1)
(2)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(2)
(2)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Options
1.8
2.5
1.8
2.5
2.5
1.8
Voltage
1.8
2.5
1.8
2.5
1.8
2.5
1.8
1.8
2.5
2.5
1.8
1.8
Package
Die Sale
8U4-1
8S1
8S1
8S1
8S2
8S2
8S2
8A2
8A2
8A2
8A2
8Y7
8P3
8P3
8S1
8S2
8Y7
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
13