NCP380HMU21AATBG ON Semiconductor, NCP380HMU21AATBG Datasheet - Page 22

• Manufacturer Part Number: NCP380HMU21AATBG
• Description: Power Switch ICs - Power Distribution OVER CURRENT PROTECTION
• Manufacturer: ON Semiconductor

Specifications of NCP380HMU21AATBG

• Product Category: Power Switch ICs - Power Distribution
• On Resistance (max): 110 mOhms
• On Time (max): 4 ms
• Off Time (max): 3 ms
• Operating Supply Voltage: 2.5 V to 5.5 V
• Supply Current (max): 90 uA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UDFN-6
• Current Limit: 2.1 A
• Maximum Power Dissipation: 830 mW
• Minimum Operating Temperature: - 40 C
• Output Current: 2.1 A

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE H
TSOP−5
0.074
DETAIL Z
1.9
22
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
A
B
C
D
G
H
K
M
J
L
S
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_