25LC080C-I/MS Microchip Technology, 25LC080C-I/MS Datasheet - Page 16

• Manufacturer Part Number: 25LC080C-I/MS
• Description: IC SRL EEPROM 1KX8 2.5V 8-MSOP
• Manufacturer: Microchip Technology

Specifications of 25LC080C-I/MS

• Memory Size: 8K (1K x 8)
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 5MHz, 10MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Organization: 1 K x 8
• Interface Type: SPI
• Maximum Clock Frequency: 10 MHz
• Access Time: 100 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

25XX080C/D
DS22151A-page 16
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
2
b
D
e
E1
A2
Dimension Limits
E
c
Units
A1
E1
A2
L1
N
A
E
D
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
© 2009 Microchip Technology Inc.
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
φ