MAX3967AE/D Maxim Integrated, MAX3967AE/D Datasheet - Page 9

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MAX3967AE/D

Manufacturer Part Number
MAX3967AE/D
Description
LED Lighting Drivers 270Mbps SFP LED Driver
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX3967AE/D

Input Voltage
2.97 V to 5.5 V
Maximum Supply Current
39 mA
Power Dissipation
1354 mW
Figure 3. Input Terminations
The MAX3967A utilizes gold metalization, which pro-
vides high reliability. Make connections to the die with
gold wire only, using ball-bonding techniques. Use
caution if attempting wedge-bonding. Pad size is 4 mils
x 4 mils (100µm). Die thickness is typically 15 mils
(375µm).
SINGLE-ENDED TERMINATION IS SHOWN. IN- SHOULD BE TERMINATED SIMILARLY.
V
3.3
5.0
RF OR NON-PECL
CC
OUTPUT
OUTPUT
PECL
R1
82
68
130
180
R2
Applications Information
_______________________________________________________________________________________
V
CC
- 2 V
50Ω
R2
V
CC
Input Terminations
R1
Wire-Bonding Die
IN+
IN+
MAX3967A
MAX3967A
270Mbps SFP LED Driver
The exposed pad on the 24-pin TQFN provides a very
low thermal resistance path for heat removal from
the IC.
TRANSISTOR COUNT: 331
SUBSTRATE CONNECTED TO V
PROCESS: BIPOLAR
DIE THICKNESS: 15 mils
Exposed-Pad Package
Chip Information
EE
9

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